2 Layers Flexible Printed Circuit Board (FPC) for Medical
Enquipment
A Flexible Printed Circuit Board (FPC), also known as a flexible
circuit, is a specialized type of printed circuit board constructed
from flexible, bendable insulating substrates. Unlike rigid PCBs
(RPCBs) that rely on inflexible materials like
fiberglass-reinforced epoxy (FR-4), FPCs leverage malleable
substrates to enable dynamic shaping, folding, or rolling—making
them ideal for electronic devices where space constraints, weight
reduction, or mechanical flexibility are critical.
Features:
- Product Name: Flexible PCB Board
- Size: Customized
- Application: Electronic Devices, Medical Equipment, Automotive
Industry
- Mini Line Width: 0.075mm
- Standard: IPC Standard
- Layer Count: 2-30 layer
Technical Parameters:
| Technical Parameter | Specification |
|---|
| Dimension | customized |
| Insulation Materials | Organic Resin |
| Board Type | Flexiable PCB |
| Service | One Stop Turnkey Service |
| Flexibility | Highly Flexible |
| Application | Electronic Devices, Medical Equipment, Automotive Industry |
| Mini Line Width | 0.075mm |
| Surface Treatment | OSP |
| Process | Immersion Gold |
| Legend Color | White |
Applications:
- Consumer Electronics:Smartphones (display/touchscreen connections,
camera modules), tablets, laptops (keyboard/trackpad links),
smartwatches, earbuds, and gaming controllers.
- Automotive Electronics:Infotainment systems, dashboard displays,
LED lighting, sensor connections (e.g., for ADAS—Advanced Driver
Assistance Systems), and battery management systems (BMS).
- Medical Devices:Flexible endoscopes, wearable health monitors
(e.g., heart rate sensors), implantable devices (e.g., pacemakers),
and diagnostic equipment (e.g., ultrasound probes).
- Aerospace & Defense:Satellite components, avionics (e.g., cockpit
displays), and military gear (where vibration resistance and
compactness are critical).
- Industrial Equipment:Robotic arms (flexible connections for moving
parts), industrial sensors, and control panels.
Future Trends•
High-Density Interconnects (HDIs):Smaller vias and finer trace
widths (down to 25μm) to support more complex circuits in tiny
spaces.• Eco-Friendly Materials:Development of recyclable or biodegradable
substrates to reduce environmental impact.• Integration with Sensors:Embedding flexible sensors (e.g.,
pressure, temperature) directly into FPCs for smart textiles,
medical wearables, and IoT devices.• 5G & High-Speed Signals:Optimized FPC designs to minimize signal
loss for 5G-enabled devices and high-frequency applications (e.g.,
radar systems).
