4-layer gold-plated flexible-rigid PCB
Product Description:
Our Rigid-Flex PCB (Rigid-Flex Printed Circuit Board) combines the durability of
rigid boards with the flexibility of flexible circuits, offering an
ideal solution for compact, high-performance
electronic devices. Engine timed for space-constrained and
high-reliability applications, this hybrid circuit board is widely
used in aerospace, medical devices, military equipment, automotive
electronics, and advanced consumer electronics.
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Advantages of Rigid-Flex PCB:
• Space-Saving Design – Eliminates the need for connectors and cables, reducing overall
assembly size and weight.
• Enhanced Reliability – Fewer interconnections mean lower risk of connection failure and
improved signal integrity.
• Superior Durability – Resistant to vibration, shock, and extreme temperatures, perfect
for harsh environments.
• Flexible Configuration – Customizable layer count (e.g., 4-layer, 6-layer, 8-layer),
materials (FR-4), and bend radius to meet your design needs.
• High-Density Interconnect (HDI) – Supports micro-vias, blind/buried vias for complex circuit
integration.
• RoHS & CE Compliant – Environmentally friendly and meets international safety
standards.
Why Choose Us?
✔ 30 Years Expertise in Rigid-Flex PCB Manufacturing
✔ ISO 9001, ROHS, and ISO /TS16949 Certified
✔ Support customized services
✔ Professional Engineering Support (DFM, impedance simulation)
✔ Global Shipping (DHL, FedEx, UPS) – Delivered to USA, Germany, UK, Japan,
Australia, etc.
Manufacturing process:
- Design and material selection: During the design phase, it is necessary to clarify which parts
need to be rigid and which parts need to be flexible. App base
materials (such as FR4, polyimide) and processes should be selected
to ensure good integration of rigid and flexible parts..
- PCB lamination: The manufacturing of rigid-flex PCBs requires the lamination of
rigid and flexible parts, which usually involves precise hot
pressing and bonding to combine different material circuit layers
into a complete PCB.
- Etching and hole processing: Photolithography and etching are performed on the laminated PCB to
form the desired circuit pattern, and hole processing is out for
component mounting and interconnection between different circuit
layers.
- Surface treatment: Surface treatment processes (such as gold plating, tin HASL, OSP,
etc.) are used to protect the surface of the circuit, ensuring its
good solderability and anti-oxidation capability.
- Assembly and testing: After completing the circuit board, perform component placement or
plug-in welding, and conduct electrical testing to ensure that the
circuit functions normally and the design requirements.
