4-layer HDI flexible PCB
Product Description:
4-layer HDI flexible PCB is a PCB that achieves higher circuit density by using thinner
lines, smaller apertures and denser wiring design. This PCB
technology can achieve more circuit connections in a limited space
by adopting more advanced manufacturing processes and design
technologies, and is widely used in mobile phones, tablets,
computers, equipment, automobiles, electronics and other medical
fields.
Product Features:
- High-density interconnection
- Micro via
- Blind and buried hole design
- Multi-level design
- Fine lines and fine pitch
- Excellent electrical performance
- Highly integrated
The main manufacturing challenges of HDI circuit boards
- Microvia processing requires laser drilling and precise plating to
ensure reliable connections
- Multilayer registration demands micron-level alignment accuracy
- Fine line fabrication needs special processes to create lines as
narrow as 0.076mm
- Signal integrity must be maintained through careful design and
simulation
- Quality inspection relies heavily on X-ray and automated optical
equipment
Advantages of High-Density Interconnect (HDI) Flexible Printed
Circuit Boards (FPC):
Miniaturization and Lightweight:
HDI technology utilizes microvias, finer lines and spaces, and higher wiring density, significantly reducing the board size
and layer count, enabling higher component density.
Flexible materials inherently contribute to a lightweight design, essential for compact electronic devices.
Superior Electrical Performance:
Features shorter signal paths which minimize signal loss, crosstalk, and delays, thereby
improving signal integrity for high-speed and high-frequency applications.
Microvias have lower parasitic capacitance and inductance,
contributing to better signal quality.
High Reliability and Durability:
The flexible nature allows the circuits to withstand bending, vibration, and shock, enhancing reliability in dynamic or harsh operating environments.
The structure and smaller aspect ratio of microvias also contribute
to increased board reliability.
Space Utilization and 3D Design:
FPCs can be bent and folded to conform to irregular product shapes or fit into confined
spaces, facilitating three-dimensional interconnections.
They can replace multiple connectors and wire harnesses,
simplifying assembly and improving overall reliability.
Long-Term Cost-Effectiveness:
While initial manufacturing costs may be higher, the ability to
reduce the number of layers, simplify assembly (by eliminating
connectors/cables), and enhance overall product reliability leads
to significant long-term system cost savings.
FAQ of HDI PCB
Q: What is the brand name of this product?
A: The brand name of this product is High Density Interconnect
Flexible PCB.
Q: Where is this product manufactured?
A: This product is manufactured in China.
Q: What is the delivery time for this product?
A: The delivery time of the products varies according to the
complexity of PCB manufacturing process.
Q: What are the payment terms for purchasing this product?
A: The payment terms for this product are T/T.
Q: What is the supply ability of this product?
A: The supply ability of this product is 3000㎡.
