OSP Green Soldermask HASL Material SMT Multilayer PCB Board refers to a multilayer printed circuit board (Multilayer PCB) designed for Surface Mount Technology (SMT) assembly, featuring a
specific combination of surface treatment, solder mask, and base
materials. Its core manufacturing process involves: first,
laminating multiple layers of substrate (with pre-etched internal
circuits) to form a multilayer structure; then, applying green solder mask ink on the outer layers to insulate and protect non-welding areas;
subsequently, treating the exposed copper pads with OSP (Organic Solderability Preservative) to prevent oxidation; and finally, using HASL (Hot Air Solder Leveling) on key solder points (if hybrid treatment is adopted) to enhance
solderability. This board integrates the advantages of OSP and HASL
treatments, making it suitable for complex electronic systems
requiring high reliability and efficient assembly.
Appearance Characteristics
Uniform green solder mask: The outer surface is covered with a consistent green solder mask,
a standard color in the electronics industry, ensuring high
visibility for visual inspection during SMT assembly and reducing
errors in component placement.
Clear layer structure: The multilayer design (typically 4 layers or more) allows for
compact routing, with the green mask providing a clear contrast
against the exposed copper pads (protected by OSP) and HASL-treated
solder points, facilitating circuit identification and maintenance.
Performance Characteristics
Dual solderability enhancement: OSP forms a thin organic film on copper pads to maintain long-term
solderability and resist oxidation, while HASL (applied selectively
or globally) creates a solderable tin-lead or lead-free alloy layer
on critical areas, ensuring strong bonding during high-temperature
SMT soldering.
High insulation and mechanical strength: The green solder mask offers excellent insulation (high volume
resistivity) to prevent short circuits between adjacent traces,
while the multilayer lamination (using high-performance substrates
like FR-4) provides robust mechanical strength, resisting warpage
under thermal stress during assembly and operation.
Signal integrity optimization: The multilayer structure allows for dedicated power and ground
planes, reducing electromagnetic interference (EMI) and crosstalk.
Combined with OSP’s minimal impact on impedance (due to its thin
layer), the board ensures stable signal transmission in
high-frequency applications (up to several GHz).
Application Adaptability
Complex electronic systems: Ideal for consumer electronics (smart TVs, routers), industrial
control systems (PLCs, sensors), and automotive electronics
(infotainment systems, ADAS modules), where multilayer routing,
high assembly efficiency, and reliable soldering are critical.
High-density SMT assembly: Its compatibility with fine-pitch components and automated
processes makes it suitable for compact devices requiring high
integration, such as medical monitors and communication base
stations.
