·The current selective soldering processes, in particular those for
lead-free soldering, multi-layer boards or high mass components,
call for increased preheat capacities.
·Short wave IR heater on the bottom and hot air convective
preheating on the top, to ensure preheating evenly
·3-axis servo drives, high control precision.
·Min. nozzle diameter is 3mm, point or drag soldering available
according to
different through hole components.
·Max. solder wave height is 5mm and controllable, soldering
penetration rate
increased largely.
·Dual-pots available, highest flexible.
·Nitrogen protection, only minute amounts of dross.
·Pot temperature is continuously monitored.
·Wave height monitoring available.
·Solder level monitoring available.
·No mechanical movement and no wearing.
·Solder wave stable and reliable.
4.Selective Soldering Electromagnetic Pump System
