This high-performance 3-layer rigid PCB is meticulously designed to
meet the demanding requirements of various advanced electronic
applications. With board dimensions of 98mm x 30mm (1 piece), it
boasts precise construction details that ensure reliability and
functionality.
PCB Specification
| Construction Detail | Specification |
| Base material | RO3006 + Tg170 FR-4 |
| Layer count | 3 layers |
| Board dimensions | 98mm x 30mm (1 piece) |
| Minimum Trace/Space | 4/4 mils |
| Minimum Hole Size | 0.3mm |
| Blind vias | Top-Inn1, Inn1-Bot |
| Finished board thickness | 0.86mm |
| Finished Cu weight | Inner: 0.5 oz (0.7 mils); Outer layers: 1 oz (1.4 mils) |
| Via plating thickness | 20 μm |
| Surface finish | OSP |
| Silkscreen | No |
| Solder Mask | No |
| Quality assurance (prior to shipment) | 100% Electrical test |
PCB Stack-up
The 3-layer rigid PCB has a well-engineered stack-up as follows:
| Layer/ Material | Thickness Specification |
| Copper_layer_1 | 35 μm |
| Rogers RO3006 | 10mil (0.254mm) |
| Copper_layer_2 | 35 μm |
| Prepreg | 0.1mm |
| FR-4 Core Tg170 | 0.4mm |
| Copper_layer_3 | 35 μm |
Artwork and Standards
Type of Artwork from customers: Gerber RS-274-X, a widely accepted
format for PCB manufacturing data.
PCB Standard: Complies with IPC-Class-2, ensuring good quality and
reliability for general electronic products.
Availability
This PCB is available worldwide, making it accessible for various
global projects.
Introduction to RO3006
Rogers RO3006 laminates are ceramic-filled PTFE composites that
offer exceptional electrical and mechanical stability. They are
specifically designed for use in commercial microwave and RF
applications. These advanced circuit materials provide a stable
dielectric constant (Dk) over a range of temperatures, eliminating
the step change in Dk that occurs for PTFE glass materials near
room temperature.
Features of RO3006
-Ceramic-filled PTFE composites.
-Dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C.
-Dissipation factor of 0.002 at 10 GHz/23°C, ensuring minimal
signal loss.
-Td> 500°C, indicating high thermal resistance.
-Thermal Conductivity of 0.79 W/mK, facilitating efficient heat
dissipation.
-Moisture Absorption of 0.02%, making it highly resistant to
moisture-related issues.
-Coefficient of Thermal Expansion (-55 to 288 °C): X axis 17
ppm/°C, Y axis 17 ppm/°C, Z axis 24 ppm/°C, ensuring dimensional
stability across a wide temperature range.
Benefits of RO3006
- Uniform mechanical properties for a range of dielectric constants,
making it ideal for multi-layer board designs with varying
dielectric constants and suitable for use with epoxy glass
multi-layer board hybrid designs.
- Low in-plane expansion coefficient (matching copper), allowing for
more reliable surface mounted assemblies, making it ideal for
applications sensitive to temperature change and providing
excellent dimensional stability.
- Volume manufacturing process with economical laminate pricing,
ensuring cost-effectiveness for large-scale production.
Typical Applications
This PCB, with its use of RO3006, is well-suited for a variety of
applications, including:
-Automotive radar applications.
-Global positioning satellite antennas.
-Cellular telecommunications systems - power amplifiers and
antennas.
-Patch antenna for wireless communications.
-Direct broadcast satellites.
-Datalink on cable systems.
-Remote meter readers.
-Power backplanes.
Conclusion
This PCB, combining RO3006 and FR-4 materials with a 3-layer
stack-up and precise craftsmanship, excels in high-frequency
stability, heat dissipation, and dimensional control. It ensures
quality through comprehensive electrical testing, making it a
practical choice with both performance and reliability for various
precision electronic applications.
