Highly Efficient Thermal Conductivity 1.2 W/MK Heat Resistant
Silicone Thermal Pads For Laptop Heatsink CPU GPU SSD IC LED Cooler
The TIF®112-12-10S-K1 Series Series thermally conductive interface materials are gap
fillers reinforced one side with kepton; the other side with
adhesive. They are applied to fill the air gaps between the heating
elements and the heat dissipation fins or the metal base. Their
flexibility and viscoelastic feature make them ideal to coat very
uneven surfaces. Its smooth, puncture-, tear-, wear-resistant
reinforcement surface is perfect for reworking and plug-in devices.
Features:
> Good thermal conductive: 1.2W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LCD TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
| Typical Properties of TIF®112-12-10S-K1 Series |
| Property | Value | Test method |
| Color | Gray/ Light amber | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Renforcement Carrier | Polyimide film | ******* |
| Thickness range | 0.012"(0.3mm) | ASTM D374 |
| Specific Gravity | 2.2 g/cc | ASTM D792 |
| Hardness | 60±5 Shore 00 | ASTM 2240 |
| Operating Temp | -40 ~ 120℃ | ****** |
| Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
| Dielectric Constant @1MHz | 4.5MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X1012 Ohm-cm | ASTM D257 |
| Fire rating | 94 V0 | UL E331100 |
| Thermal conductivity | 1.2 W/m-K | ASTM D5470 |
Product Thicknesses: 0.012-inch (0.3mm )
Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied.
Please contact us for confirming
Safe disposal method does not require special protection.The
storage condition is low temperature anddry, away from open fire
and away from direct sunlight. For detailed method, please refer to
the product material safety data sheet.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to
developing composite thermal solution and manufacturing superior
thermal interface materials for competitive market. Our vast
experience allows us to assist our customers best in thermal
engineering field.We serve customers with customized products, full
product lines and flexible production, which makes us be the best
and reliable partner of you. Let's make your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team,
engineering team, R&D team, Manufacturing team, logistics team.
All is for supporting and servicing a satisfy service for
customers.
