Premium Soft 1.5W/MK Silicone Thermal Pad For Handheld Portable
Electronics
The TIF®100-01US is a silicone based, thermally conductive gap pad. Its
unreinforced construction allows additional compliancy. This
product has low hardness is conformable and is electrically
isolating. The low modulus characteristic of the product offers
optimal thermal performance with the ease of handling.
Features:
> Good thermal conductive :1.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Easy release construction
> Electrically isolating
> High durability
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LCD TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> CPU
> Memory Modules
> Audio and video components
> Power supply
> Heat pipe thermal solutions
> Memory Modules
| Typical Properties of TIF®100-01US Series |
| Property | Value | Test method |
| Color | Black | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Thickness range | 0.020"(0.5mm)~0.200"(5.0mm) | ASTM D374 |
| Specific Gravity | 1.9 g/cc | ASTM D792 |
| Hardness | 20±5 Shore 00 | ASTM 2240 |
| Operating Temp | -40 ~ 200℃ | ****** |
| Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
| Dielectric Constant @1MHz | 2.9 MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X1012 Ohm-cm | ASTM D257 |
| Fire rating | 94 V0 | UL E331100 |
| Thermal conductivity | 1.5 W/m-K | ASTM D5470 |
Product Thicknesses: 0.020"(0.5mm)~0.200"(5.0mm)
Product Sizes: 8" x 16"(203mm x 406mm)
Individual die cut shapes and custom thickness can be supplied.
Please contact us for confirming
Safe disposal method does not require special protection.The
storage condition is low temperature anddry, away from open fire
and away from direct sunlight. For detailed method, please refer to
the product material safety data sheet.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and
manufacturing superior thermal interface materials for competitive
market. Our vast experience allows us to assist our customers best
in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make
your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality
control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
