TP600 PCB: 2-Layer, 5.08mm Core, 5.1mm Thickness with ENIG Finish
(All PCBs are custom-manufactured. Reference images and parameters
may vary based on your design requirements.)
Overview of TP600 2-Layer PCB
The TP600 PCB is a high-performance 2-layer rigid PCB, engineered
for high-frequency, high-reliability applications such as global
satellite navigation systems, miniaturized antennas, and
missile-borne systems. Featuring a thick 5.08mm (200mil) TP600 core
and a finished thickness of 5.1mm, this PCB offers low loss,
thermal stability, and excellent dielectric performance.
With a dielectric constant (Dk) of 6.0 ± 0.12 and a dissipation
factor (Df) of 0.0010 at 10GHz, the TP600 PCB is ideal for
precision RF and microwave applications. The Electroless Nickel
Immersion Gold (ENIG) surface finish ensures superior
solderability, oxidation resistance, and long-term durability.
PCB Construction Details
| Parameter | Specification |
| Base Material | TP600 |
| Layer Count | 2 layers |
| Board Dimensions | 25mm x 25mm |
| Minimum Trace/Space | 6/7 mils |
| Minimum Hole Size | 0.7mm |
| Blind Vias | None |
| Finished Thickness | 5.1mm |
| Copper Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Electrical Testing | 100% tested before shipment |
PCB Stackup
| Layer | Material | Thickness |
| Copper Layer 1 | Copper (1oz) | 35μm |
| Dielectric Layer | TP600 Core | 5.08mm (200mil) |
| Copper Layer 2 | Copper (1oz) | 35μm |
Introduction to TP600 Material
The TP600 material is a high-frequency thermoplastic composite,
combining ceramics and polyphenylene oxide resin (PPO) for
excellent dielectric and thermal properties. Unlike
fiberglass-reinforced laminates, TP600 is free of fiberglass,
enabling low-loss, stable performance across a wide range of
frequencies.
Key Features of TP600
- Dielectric Constant (Dk): 6.0 ± 0.12 at 10GHz.
- Dissipation Factor (Df): Extremely low at 0.0010 at 10GHz.
- Thermal Conductivity: 0.55 W/m·K for efficient heat management.
- Moisture Absorption: Extremely low at 0.01%.
- CTE (Coefficient of Thermal Expansion): X-axis: 50 ppm/°C. Y-axis:
50 ppm/°C. Z-axis: 60 ppm/°C.
- Low TCDk: -50 ppm/°C, ensuring stable performance over temperature
ranges from -55°C to 150°C.
- UL 94-V0 Certified: Flame-retardant properties for safety-critical
applications.
Benefits of TP600
- Stable Dk Across Frequencies: Consistent dielectric properties for
high-frequency applications.
- Low Dielectric Loss: Ideal for precision RF and microwave designs.
- Excellent Thermal Stability: Reliable performance in harsh
environments or high-power applications.
- High Reliability: Resistant to moisture and mechanical stress.
Applications
Global Satellite Navigation Systems
Missile-Borne Systems
Fuze Technology
Miniaturized Antennas
The TP600 2-layer PCB is a cutting-edge solution for RF, microwave,
and high-reliability applications, offering low dielectric loss,
thermal stability, and mechanical durability. With its 5.08mm TP600
core, ENIG finish, and stable dielectric properties, this PCB is
ideal for satellite systems, miniaturized antennas, and missile
technology.
Compliant with IPC-Class-2 standards and available worldwide, the
TP600 PCB is the perfect choice for engineers designing
high-frequency, low-loss circuits for critical applications.
