In PCB manufacturing, to improve production efficiency and
facilitate assembly, multiple identical small circuit boards are
often assembled into a single large board for production and
placement. After all these steps are completed, they need to be
cleanly and non-destructively separated. This process is called
depaneling, and the machine that performs this process is a PCB
separator.
1. Power supply: single-phase AC220V 50-60HZ.
2. Weight: 60KG.
3. Machine size: 770mm (length) * 370mm (width) * 420mm (height).
4. Cutting speed: 300mm/s.
5. Maximum stroke of the knife wheel: 350mm.
6. Fine adjustment of the knife wheel: 0-3mm.
7. The lower knife can be adjusted: 0-2mm.
8. The width of the rear baffle is: 150mm, the maximum PC board cutting width: 150mm, the maximum PC
board cutting length: 350mm, the thickness of the PC board that can
be cut: 0.6-3.2mm, the thickness between the V grooves: 0.25-2.0mm.
9. The infrared radiation switch is used for safety protection. When the hand or foreign object is
in the knife movement area, the machine stops working to ensure
safe operation.
10. The machine is driven by a stepper motor, which can be self-locked and precisely cut and positioned when
powered on. It solves the problem that the travel point of DC and
AC motors changes after working for a period of time due to
inertia.
11. After connecting multiple PC boards with solder, breaking often damages the circuit or breaks the electronic parts.
Using this machine can avoid damage and improve work efficiency and
quality.
12. The above circular knife walking and cutting can completely reduce stress, prevent solder joints from cracking
and parts from breaking.
13. The upper circular knife and lower flat knife method is adopted. The PC board is placed on the lower flat knife. Once
the switch is stepped on, the upper circular knife moves
horizontally to the set fixed point, and the PC board is cut and
divided. The cutting does not fall off and the incision is smooth.
14. The upper and lower knives are imported high-speed steel, the knives are durable, and when the knives are not sharp, they
can be re-grinded, about 2 times.
Scoring Depaneler
Principle: A high-speed rotating milling cutter cuts along pre-designed
V-grooves (V-cuts) in the board.
Advantages: Fast, relatively low cost, suitable for depaneling simple shapes
and straight lines.
Disadvantages: Generates stress dust and places stress on the board edges, making
it unsuitable for very fragile or high-density boards.
Routing Depaneler
Principle: Similar to a CNC machine tool, a high-speed spindle drives the
milling cutter, precisely cutting along a programmed path.
Advantages: Minimal stress, capable of cutting any shape (curved or
irregularly shaped), with high precision and smooth, clean edges.
Disadvantages: Slower than the Scoring Depaneler, with higher equipment and
maintenance costs.
Applications: Widely used in applications requiring high reliability, such as
mobile phones, automotive electronics, and aerospace.
Laser Depaneler
Principle: Uses a high-energy laser beam to melt the material, achieving
contactless cutting.
Advantages: Completely stress-free, extremely high precision, narrow kerf,
dust-free, and capable of processing very delicate flexible printed
circuits (FPCs).
Disadvantages: High equipment cost, relatively slow cutting speed, and complex
parameter adjustments for different materials (such as copper and
FR4).
