High Thermal Conductive Two Component Potting Silicone For LED And
Power Drive Potting
Products description
TIG®680-15AB is a two-part silicone potting adhesive with high thermal
conductivity, room temperature curable, long working time and fire
resistance. lt is especially suitable for capacitor, smal
electronic equipment sealing. Its flexible, elastic characteristics
enable it to provide cushioning for the materials it is coated
with. The lower viscosity allows the thermal potting adhesive to
cover the surface more fully, greatly increasing the efficiency of
heat transfer from the heating device or the entire PCB to the
metal case or diffusion plate, thus improving the efficiency and
service life of the electronic components.
Feature
> Good thermal conductivity: 1.5±0.2 W/mK
> Good insulation performance
> Good elasticity
> Lower shrinkage
> Low viscosity,easy gas emissions
> Good solvent resistance and waterproof performance
> longer working hours
> Excellent high and low temperature resistance
> No odor release during the curing process
Application
> Industrial control, transformer,coil,amplifier, high voltage
package,relay, high current junction box,etc
> Heat sink assembly, thermal sensor potting, thermal conductive
product potting
> Heat conduction between the battery cell and the cold tube
> LED and power drive potting
| Typical Properties of TIG®680-15AB Series |
| Material Properties(before Curing) |
| Property | Numerical | Test Method |
| Color / Part A | White | Visual |
| Color / Part B | Gray | Visual |
| Part A Viscossity(mPa·s) | 5000±1000 | GB/T 10247 |
| Part B Viscossity(mPa·s) | 5000±1000 | GB/T 10247 |
| Mix Ratio | 1:1 | Ziitek Test Method |
| Shelf life | 6 Months (Unopened) | Ziitek Test Method |
| Cure Schedule |
| Pot Life @25℃ | 30~45 mins | Ziitek Test Method |
| Cure @70℃ | 20~30 mins | Ziitek Test Method |
| Cure Material Properties |
| Color | Gray | Visual |
| Hardness (Shore A) | 45±5 | ASTM D2240 |
| Density (g/cc) | 2.35±0.1 | ASTM D792 |
| Recommended Operating Temp (℃) | -45~200 | Ziitek Test Method |
| Flame Rating | V-0 | UL 94 |
| Thermal Conductivity (W/mK) | 1.5±0.2 | ASTM D5470 |
| Breakdown Voltage(V/mm) | ≥8000 | ASTM D149 |
| Dielectric Constant@1MHz | 5.0~7.0 | ASTM D150 |
| Volume Resistivity (Ohm-cm) | 1.0*1014 | ASTM D257 |
Storage
1. Store the potting compound in the original unopened container;
2. Store in a cool and dry place to ensure the proper shelf life.
Company profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was
established in 2006. Is a high-tech enterprise specializing in the
research, development, production and sales of thermal interface
materials. We mainly produce: heat-conducting joint filler, low
melting point thermal interface materials, heat-conducting
insulator, heat-conducting adhesive tape, heat-conducting interface
pad and heat-conducting grease, heat-conducting plastic, silicone
rubber, silicone rubber foam, etc. We adhere to the business
philosophy of "survival by quality, development by quality", and
continue to provide the most efficient and best service for new and
old customers with excellent quality in the spirit of rigor,
pragmatism and innovation.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality
control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What's the thermal conductivity test method given on the data
sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM
D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat
dissipation. Please tell us your detailed applications and the
power, so we can recommend most suitable thermal conductive
materials.
