1.2W/Mk Thermal Gap Filler Pad Multi Size Silicone Pad
High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and
manufacturing superior thermal interface materials for competitive
market. Our vast experience allows us to assist our customers best
in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make
your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Products description
The TIF®100-12-05ES Series thermally conductive interface materials are gap fillers
reinforced one side with kepton; the other side with adhesive. They
are applied to fil the air gaps between the heating elements and
the heat dissipation fins or the metal base. Their flexibility and
viscoelastic feature make them ideal to coat very uneven surfaces.
Its smooth, puncture-, tear-, wear-resistant reinforcement surface
is perfect for reworking and plug-in devices.
Features
> Good thermal conductive: 1.2W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> Broad range of hardnesses available
> Moldability for complex parts
Applications
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
| Typical Properties of TIF®100-12-05ES Series |
| Color | Blue | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Thickness range | 0.020"(0.5mm)~0.200"(5.0mm) | ASTM D374 |
| Specific Gravity | 2.0g/cc | ASTM D297 |
| Hardness | 12±5 Shore 00 | ASTM 2240 |
| Operating Temp | -40 ~ 160℃ | ****** |
| Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
| Dielectric Constant @1MHz | 4.5MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X1012 Ohm-cm | ASTM D257 |
| Fire rating | 94 V0 | UL E331100 |
| Thermal conductivity | 1.2 W/m-K | ASTM D5470 |
Product Thicknesses:
0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:
8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied.
Please contact us for confirming.
Safe disposal method does not require special protection. The
storage condition is low temperature and dry, away from open fire
and away from direct sunlight. For detailed method, please refer to
the product material safety data sheet.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and
message to us.
This message should include any questions you might have about the
products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the
process and send your message to us.
4. We will reply you as soon as possible with Email or online.
