Product Description:
Custom JEDEC Tray offers excellent compatibility and can fit
multiple types and sizes of chips. Meanwhile, the design of the
tray fully considers the operational requirements of automated
equipment, enabling the tray to achieve rapid and accurate
positioning and replacement on automated production lines with
ease. This flexibility not only improves production efficiency but
also reduces operational difficulty and costs.It is widely used in
the production, storage and transportation of semiconductor
devices.
Technical Parameters:
| Color | Black |
| Molding Method | Injection Moulding |
| Surface Resistant | 10e4-10e11ohms |
| Peculiarity | Permanent Antistatic |
| Shaping Mode | Plastic Injection Mould |
| Clean Class | General And Ultrasonic Cleaning |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Material | Plastic |
| Certifications | RoHS, REACH |
| Mold Type | Injection |
Applications:
I. Electronics Manufacturing Field
It is mainly used in the mass production process of ICs (Integrated
Circuits) to ensure product quantity consistency, improve
production efficiency, and reduce costs. The standard storage and
transportation device for JEDEC Trays can protect chips from
collision and scratches, ensuring the safety of chips during
storage and transportation.
II. Batch Production Requirements
When dealing with large orders, Custom JEDEC Trays can ensure
product uniformity and efficiency, improve production efficiency,
reduce production costs, and meet the needs of batch production.
FAQ:
Q:How is the compressive strength of the product?
A:It is quite excellent, and will not be affected during
transportation and use.
Q:What is the difference between regular products and customized
products?
A:Regular products have stronger applicability, while customized
products can meet the specific needs of customers.
Q:If we place a large order, can we get any discounts or special
offers?
A:Of course, we can negotiate the specific discounts together.
