This advanced 6-layer rigid PCB is designed for high-frequency and
high-reliability applications, combining Rogers RO4003C and Tg170
FR-4 materials for optimal electrical and mechanical performance.
The board features a hybrid stack-up to balance cost,
manufacturability, and signal integrity, making it ideal for RF and
microwave applications.
| Specification Category | Details |
| Base Materials | Rogers RO4003C (high-frequency laminate) + Tg170 FR-4 (standard
laminate) |
| Board Dimensions | 495mm × 345mm, with a tolerance of ±0.15mm |
| Layer Count | 6 layers |
| Finished Thickness | 6.8mm |
| Copper Weight | 1oz (35μm) on all layers |
| Minimum Trace/Space | 5 mils (trace) / 6 mils (space) |
| Minimum Hole Size | 0.8mm |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold (ENIG) |
| Blind/Buried Vias | None |
| Solder Mask & Silkscreen | None |
| Depth-Controlled Slots | Yes (present on top and bottom layers) |
| Electrical Testing | 100% tested before shipment |
PCB Stack-up Details
The stack-up is meticulously optimized to enhance signal integrity
and thermal stability:
| Layer | Material | Thickness |
| Copper (L1) | 35μm (1oz) | - |
| Core | Tg170 FR-4 | 3.0mm |
| Copper (L2) | 35μm (1oz) | - |
| Bonding Ply | Prepreg (4mil) | 0.102mm |
| Copper (L3) | 35μm (1oz) | - |
| Core | Rogers RO4003C (12mil) | 0.305mm |
| Copper (L4) | 35μm (1oz) | - |
| Bonding Ply | Prepreg (4mil) | 0.102mm |
| Copper (L5) | 35μm (1oz) | - |
| Core | Tg170 FR-4 | 3.0mm |
| Copper (L6) | 35μm (1oz) | - |
Introduction to Rogers RO4003C Material
Rogers RO4003C is a high-frequency laminate that merges the
electrical performance of PTFE/woven glass with the fabrication
simplicity of epoxy/glass. It stands out in RF and microwave
applications due to its tight dielectric constant control and low
dissipation factor.
Key Features of Rogers RO4003C
1. Stable Dielectric Constant (Dk): Maintains a consistent 3.38
±0.05 at 10GHz, ensuring reliable signal propagation in
high-frequency designs.
2. Low Dissipation Factor (Df): Measures 0.0027 at 10GHz and 0.0021 at
2.5GHz, minimizing signal loss even in high-speed applications.
3. Effective Thermal Conductivity: 0.71 W/m/°K, facilitating
efficient heat dissipation from active components.
4. Minimal Moisture Absorption: Only 0.06%, preserving electrical
performance in humid environments.
Strong CTE Compatibility with Copper:
X-axis: 11 ppm/°C
Y-axis: 14 ppm/°C
Z-axis: 46 ppm/°C
This reduces stress between layers during thermal cycling,
enhancing long-term reliability.
5. High Glass Transition Temperature (Tg >280°C): Ensures
stability under extreme thermal stress, critical for rugged
operating conditions.
Advantages of Using RO4003C
1. Ideal for Multi-Layer RF/Microwave PCBs: Balances high-frequency
performance with the structural needs of complex layer stacks.
2. FR-4 Compatible Processing: Eliminates the need for specialized
manufacturing techniques, lowering production costs and simplifying
fabrication.
3. Enhanced Signal Integrity: Low Dk variation and minimal loss
make it perfect for high-frequency signals (e.g., RF, microwave),
reducing distortion and ensuring data accuracy.
4. Durable Plated Through-Holes (PTH): Maintains integrity even
under thermal shock, a key requirement for reliable interconnects
in demanding applications.
Typical Applications
This PCB is ideally suited for:
Cellular Base Station Antennas & Power Amplifiers
RF Identification (RFID) Tags
Automotive Radar & Sensors
Low-Noise Block (LNB) for Satellite Communications
High-Speed Digital & Mixed-Signal Designs
Conclusion
This 6-layer hybrid PCB harnesses the high-frequency capabilities
of Rogers RO4003C and the structural robustness of Tg170 FR-4,
resulting in a cost-effective yet high-performance solution for
demanding RF and microwave applications.
Available worldwide, this PCB is an excellent option for engineers
seeking a balance between performance, manufacturability, and cost.
