Meet our high-performance double-layer rigid PCB, expertly crafted
using Rogers RO4350B material. It is designed for a variety of
high-frequency and RF applications where reliable performance and
cost-effectiveness are crucial, making it an excellent choice for
cellular base stations, automotive radar, and more.
The stack-up of this PCB is carefully designed as follows:
Copper_layer_1: 35 μm
Rogers RO4350B Core: 0.422 mm (16.6mil)
Copper_layer_2: 35 μm
PCB Details
| Parameter | Specification |
| Base Material | RO4350B |
| Layer Count | Double sided |
| Board Dimensions | 42.3 mm x 30.8 mm=1PCS, +/- 0.15mm |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 0.5mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Electroless Nickel Electroless Palladium Immersion Gold |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| Electrical Testing | 100% tested prior to shipment |
What Makes RO4350B Material Stand Out?
Material Composition & Performance Balance
Rogers RO4350B materials are proprietary woven glass reinforced
hydrocarbon/ceramics. They strike a unique balance: electrical
performance close to PTFE/woven glass, while maintaining the
manufacturability of epoxy/glass.
Processing & Cost Advantages
RO4350B laminates provide tight control on dielectric constant (Dk)
and maintain low loss, all while using the same processing methods
as standard epoxy/glass. They are available at a fraction of the
cost of conventional microwave laminates and eliminate the need for
special through-hole treatments or handling procedures required by
PTFE-based materials. Plus, they’re UL 94 V-0 rated, making them
suitable for active devices and high-power RF designs.
Thermal Stability Benefits
RO4350B’s thermal coefficient of expansion (CTE) offers key
advantages:
Its expansion coefficient is similar to copper, ensuring excellent
dimensional stability—critical for mixed dielectric multi-layer
board constructions.
The low Z-axis CTE guarantees reliable plated through-hole quality,
even in severe thermal shock applications.
With a Tg of >280°C (536°F), its expansion characteristics stay
stable across the entire range of circuit processing temperatures.
Key Features
-Dielectric Constant of DK 3.48 +/-0.05 at 10GHz/23°C
-Dissipation Factor of 0.0037 at 10GHz/23°C
-Thermal Conductivity 0.69 W/m/°K
-X axis CTE of 10 ppm/°C, Y CTE of 12 ppm/°C, Z CTE of 32 ppm/°C
-High Tg value of >280 °C
-Low water absorption of 0.06%
-UL 94 V-0 rated
Benefits
-Ideal for multi-layer board (MLB) constructions
-Processes like FR-4 at lower fabrication cost
-Excellent dimensional stability
-Competitively priced
Where Can It Be Used?
The unique properties of RO4350B make this PCB suitable for a range
of applications:
-Cellular Base Station Antennas and Power Amplifiers
-RF Identification Tags
-Automotive Radar and Sensors
-LNB's for Direct Broadcast Satellites
-Compliance & Availability
This PCB meets strict IPC-Class-2 standards, ensuring consistent
quality and reliability. The type of artwork supplied is Gerber
RS-274-X for seamless production integration.
We offer worldwide availability, making this high-quality PCB
accessible to engineers and manufacturers across all regions.
Choose this PCB for a solution that delivers on both quality and
value.
