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FCBGA SiP Inline Jet Underfill Dispensing Machine FCCSP Electronic Dispensing Machine

    Buy cheap FCBGA SiP Inline Jet Underfill Dispensing Machine FCCSP Electronic Dispensing Machine from wholesalers
     
    Buy cheap FCBGA SiP Inline Jet Underfill Dispensing Machine FCCSP Electronic Dispensing Machine from wholesalers
    • Buy cheap FCBGA SiP Inline Jet Underfill Dispensing Machine FCCSP Electronic Dispensing Machine from wholesalers

    FCBGA SiP Inline Jet Underfill Dispensing Machine FCCSP Electronic Dispensing Machine

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    Brand Name : Mingseal
    Model Number : GS600SU
    Certification : ISO
    Price : $28000-$150000 / pcs
    Payment Terms : L/C,D/A,D/P,T/T,Western Union
    Delivery Time : 5-60 Days
    • Product Details
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    FCBGA SiP Inline Jet Underfill Dispensing Machine FCCSP Electronic Dispensing Machine

    FCBGA SiP FCCSP Solution Inline Jet Underfill Dispensing Machine


    The GS600 Series Inline Jet Underfill Dispensing Machine is an advanced, high-precision dispensing solution designed specifically for FCCSP, SiP, and FCBGA semiconductor packaging manufacturers who demand exceptional process control for Capillary Underfill (CUF) applications.

    This model combines Mingseal’s proprietary piezoelectric jetting system with a dual-track inline configuration. It supports cleanroom-level operations while offering a compact footprint that optimizes valuable cleanroom space. The GS600 Series enables manufacturers to handle ultra-small glue volumes down to 0.001mg/dot, delivering precise die underfill with minimal voids—crucial for next-generation chip packaging. Users can also choose a standalone configuration with manual loading/unloading, or scale up with a fully automated handler or inline connection for seamless integration into existing SMT/SiP lines.


    Core Advantages

    • Precision Jetting for CUF: Ensure micro-volume underfill with superior dot consistency.

    • Dual-Track Efficiency: Boost UPH within a tight factory footprint.

    • Advanced Process Control: Features real-time glue weight monitoring, bottom heating, and vacuum-assisted substrate holding.

    • Compact Footprint, High ROI: Designed for space-constrained semiconductor cleanrooms.

    • Industry-Ready: Compatible with semiconductor MES systems and standard communication protocols for smart traceability.



    Typical Applications


    ✔ FCCSP (Flip Chip Chip Scale Package)
    ✔ SiP (System in Package) Multi-Chip Modules
    ✔ FCBGA Underfill Encapsulation
    ✔ Fine-Pitch Flip Chip CUF Processes
    ✔ Die Attach and Corner Fill for Advanced Packages
    ✔ Ultra-Fine Jetting for MEMS and IC Packaging



    Technical Specifications

    Cleanliness Level

    Cleanliness of working area

    Class 100 (Class 1000 workshop)

    Class 10 (Class 100 workshop)

    Transmission Mechanism

    Transmission system

    X/Y:Linear motor

    Z: Servo motor&Screw module

    Repeatability (3sigma)

    X/Y: ±0.003mm, Z: ±0.005mm

    Positioning accuracy (3sigma)

    X/Y: ±0.010mm, Z: ±0.015mm

    Max. movement speed

    X/Y: 1000mm/s

    Z: 500mm/s

    Max. accelerated velocity

    X/Y: 1g

    Z: 0.5g

    Grating resolution

    1μm

    Z axis movement range(W× D)

    3 5 0 mm×4 7 0mm

    Z axis height calibration & compensation Method

    Laser sensor (Laser sensor)

    Laser sensor accuracy

    m

    Dispensing System

    Glue control accuracy

    ± 3 % / 1mg

    Single dot position repeatability CPK>1.0

    ±25 μ m

    Min. nozzle diameter

    30 μ m

    Min. single dot glue weight

    0 .001mg/dot

    Max. fluid viscosity

    200000cps

    Max. jetting frequency

    1000Hz

    Runner/nozzle heating temperature

    Room temperature~200℃

    Runner/nozzle heating temp. deviation

    ± 2 ℃

    Applicable adhesive packaging spec.

    5CC/ 10CC/ 30CC/ 50CC/ 70CC

    Syringe cooling range

    Cools down to 15°C below ambient temp.

    Piezo cooling range

    Cools down to compressed air source temp.

    Track System

    Number of tracks

    2

    Number of belt sections

    One piece

    Max. track transmission speed

    300mm/s

    Max. track transmission weight

    3kg

    Minimum edge clearance

    3 mm

    Track width adjustment range

    60mm~ 162mm Adjustable

    Track width adjustment Method

    Manual

    Track height

    910mm~960mm Adjustable

    Max. thickness of applicable substrate/carrier

    6 mm

    Applicable substrate/carrier length range

    60mm-325mm

    Vacuum suction pressure Range

    -50~-80Kpa (Adjustable)

    Bottom heating temperature range

    Room temperature~180℃

    Bottom heating temp. deviation

    ≤ ± 1.5 ℃

    Facilities

    Footprint (W× D× H)


    2380mm*1550mm*2080mm

    (Loading, Unloading, and display included)

    2380mm*1200mm*2080mm

    (Loading&Unloading included, display excluded)

    Weight

    1600kg

    Power supply

    200~240VAC, 47~63Hz (Single-phase voltage adaptation power supply)

    Electric current

    30A

    Power

    6.4KW

    Inhale

    (0.5Mpa, 450L/min) ×2



    FAQ


    Q1: What makes the GS600 Series ideal for CUF?
    A: Its dedicated piezo jetting system enables ultra-fine dot sizes down to 30μm with a minimum glue weight of 0.001mg—essential for void-free underfill of fine-pitch dies.


    Q2: How does it handle small-batch and high-volume needs?
    A: The GS600 can run in manual load/unload mode for small lots or link to auto handlers and inline tracks for continuous high-volume production.


    Q3: Can it work in strict cleanroom conditions?
    A: Yes—its mineral-based stable frame and enclosed system maintain consistent performance under Class 100 cleanroom requirements.


    Q4: What value does Mingseal add?
    A: Mingseal is a trusted high-precision dispensing specialist, delivering thousands of inline and desktop solutions globally. We back every unit with expert process engineering and local support to help you optimize yield, process control, and ROI.



    Conclusion


    Mingseal’s GS600 Series brings industry-leading underfill jetting technology to FCCSP, SiP, and FCBGA manufacturers seeking precise CUF with minimal footprint. Whether you need tight process control for next-gen packaging or flexible line integration, the GS600 is your proven partner for high-yield microelectronics production.


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