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Inline Visual Solder Paste Dispenser with 220-300 Microns Dot Uniformity for PCB Pad Applications

    Buy cheap Inline Visual Solder Paste Dispenser with 220-300 Microns Dot Uniformity for PCB Pad Applications from wholesalers
     
    Buy cheap Inline Visual Solder Paste Dispenser with 220-300 Microns Dot Uniformity for PCB Pad Applications from wholesalers
    • Buy cheap Inline Visual Solder Paste Dispenser with 220-300 Microns Dot Uniformity for PCB Pad Applications from wholesalers
    • Buy cheap Inline Visual Solder Paste Dispenser with 220-300 Microns Dot Uniformity for PCB Pad Applications from wholesalers
    • Buy cheap Inline Visual Solder Paste Dispenser with 220-300 Microns Dot Uniformity for PCB Pad Applications from wholesalers
    • Buy cheap Inline Visual Solder Paste Dispenser with 220-300 Microns Dot Uniformity for PCB Pad Applications from wholesalers

    Inline Visual Solder Paste Dispenser with 220-300 Microns Dot Uniformity for PCB Pad Applications

    Ask Lasest Price
    Brand Name : Mingseal
    Model Number : GS600M
    Certification : ISO CE
    Price : $28000-$150000 /pcs
    Payment Terms : L/C,D/A,D/P,T/T,Western Union
    Delivery Time : 5-60 Days
    • Product Details
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    Inline Visual Solder Paste Dispenser with 220-300 Microns Dot Uniformity for PCB Pad Applications

    Inline Visual Solder Paste Dispensing Solution for PCB Pad Applications


    In modern printed circuit board assembly, precise solder paste application is a critical factor for ensuring high-quality electrical connections and reliable device performance. The Mingseal GS600 Series Inline Visual Dispensing Machine is purpose-built for high-accuracy solder paste dispensing directly onto PCB pads, supporting tight process requirements across high-volume production lines.

    Designed to deliver consistent dot diameters in the typical range of 220–300 microns, the GS600 series helps manufacturers achieve excellent paste uniformity across all pads, which is essential for clean solder joints during reflow. Its integrated camera recognition module and visual alignment system ensure that each paste dot is placed exactly where it should be, minimizing defects such as bridging or insufficient solder.



    Key Advantages


    • Consistent Dot Uniformity: Achieve precise solder paste dots with a typical diameter range of 220–300 microns and excellent consistency across every pad.
    • Integrated Camera Recognition: Advanced image recognition and positioning modules align each pad for accurate paste placement, improving first-pass yield.
    • Inline Production Ready: Support high-speed SMT lines and can be easily integrated into existing production setups.
    • Real-Time Process Control: Visual modules inspect dispensing quality, detect missing dots, and monitor paste application.


    Typical Applications


    ✔ High-precision solder paste dispensing on PCB pads
    ✔ Micro solder bumping for fine-pitch components
    ✔ Pad coating for microelectronics or module assembly
    ✔ Small-format board or flexible board solder paste application
    ✔ LED or sensor PCB pad soldering preparation



    Key Specifications


    Motion System

    Transmission System

    X/Y:Linear motor

    Z:Servo motor&Screw module

    Max. Dispensing Range

    X*Y: 280*170mm (Single track) --with loaing & unloading

    X*Y: 360*520mm/ 360*215mm (Single/ Double track) -- w/o loading & unloading

    Effective travel

    X*Y: 380*610mm

    Repeatability (3 sigma)

    X/Y±10μm, Z≤±10μm

    Positioning Accuracy

    X/Y≤±15μm, Z≤±15μm

    Max. Speed

    X/Y: 1300mm/s, Z: 500mm/s

    Max. Acceleration

    X/Y: 1.3g, Z: 0.5g

    Correction System

    Visual Positioning Method

    Mark/ Product Appearance

    Fly-align Positioning

    max: 300m/s

    Laser Altimetry

    Measurement Range: ±5 mm, Repeatability Accuracy 1μm,

    Sampling Frequency: 2k

    Track System

    Number of Tracks

    Single track / Double tracks

    Width Adjustment Range

    40-170mm

    Side Pushing Accuracy

    ≤0.02mm

    Loading & Unloading Module

    Suspended loop-type / Floor-standing loop-type loading & unloading, Touchable screen teaching



    FAQ


    Q1: How does the GS600M achieve consistent solder paste dots?
    A: The system combines high-precision valve control with camera-guided pad recognition to ensure each dot is uniform in diameter and position.


    Q2: Is this machine suitable for small and dense PCBs?
    A: Yes. The GS600 series is designed for fine-pitch pads and high-density layouts, with vision modules that adjust dot placement in real time.


    Q3: What types of solder paste can be used?
    A: The machine handles a wide range of solder paste formulations and viscosities, making it flexible for different product requirements.


    Q4: Can it be integrated into an existing SMT line?
    A: Absolutely. Its inline conveyor system and MES compatibility make it easy to connect with other production equipment and traceability systems.



    About Mingseal


    Mingseal is a specialist in precision inline and desktop dispensing systems for the global electronics industry. We design and manufacture advanced machines that combine stable mechanical platforms, flexible modular options, and intelligent vision systems. Our solutions help factories in Asia, Europe, and North America boost production efficiency, product quality, and profitability.

    Contact Mingseal today to discover how the GS600M Inline Visual Solder Paste Dispensing Machine can upgrade your PCB assembly process with outstanding dot accuracy, process stability, and smart factory readiness.


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