HMA Glue Hot Melt Adhesive Piezo Jet Valve for Smartphone/PAD Frame
Bonding application
Piezoelectric jetting valves are increasingly used in hot melt adhesive dispensing for
smartphone/pad middle frame and bezel assembly. These
high-precision, non-contact jetting valves provide excellent control over glue volume and placement.
For hot melt applications, maintaining stable glue temperature is
critical to ensure smooth flow and avoid nozzle clogging or
stringing.
Mingseal’s hot melt piezo valve system KPS2000-R is specially designed for this process. It includes a dedicated
heated glue tank and special seals that maintains adhesive
viscosity within optimal range throughout the operation. This
enables extended open time, avoiding premature curing and
minimizing downtime due to nozzle maintenance.
The solution is ideal for edge sealing, frame bonding, and
multi-point glue dispensing on smartphones and tablets, where space
is limited and aesthetics are critical. Jetting performance remains
stable across high-speed production lines, supporting cycle times
as low as milliseconds per dot.
Core Advantages
- Non-contact spraying
- High-temperature spraying capability
- High-speed precision dispensing
- Fine glue dot control
- Cost effective and high performance
Main appliaction
Mobile phone middle frame glue dispensing: hot melt glue is applied to the inner edge of the middle frame for
bonding glass cover, OLED module or metal backplane.
PAD middle frame glue dispensing: larger size, longer glue dispensing path, requiring uniform glue
spraying and fast speed.
Multi-point positioning/rib bonding: bonding of local structural parts, such as internal bracket, FPC
fixing position, and nut position glue dispensing.
Technical parameters
| KPS2000-R adhesive dispensing valves |
| Minimum glue spraying amount | 0.5nl(CPK＞1.33) |
| Viscosity of glue | Medium or high viscosity up to 500,000mpas |
| Max jetting frequency | 1200Hz |
| Work temperature range | 10～50°C |
| Corrosion resistance | All aqueous media, organic solvents, weak acids and weak bases |
| Size | 125.5×40×20mm(No runner assembly included)125.5×75×20mm(Includes
runner assembly) |
| Weight | 430g(With fluid box, no cables) |
| KPC2000 controller |
| AC power input | AC 220V±20% |
| 0.01ms~6000.00ms,0.01ms |
| Jetting frequency | 1~1200HZ |
| Settings display | TFT color screen |
| 10 set |
| Reserved interface | Supports RS232/RS485 |
| Weight | 3.55KG |
| Size | 232×170×165 mm |
| Power | 275W |
FAQ
Q1: Can a piezo jet valve handle high-viscosity hot melt adhesives
for smartphone frame bonding?
A1: Yes. Piezo jet valves are capable of dispensing high-viscosity
hot melt adhesives with excellent consistency. Models like
Mingseal’s hot melt series include heating modules to maintain
stable fluidity, ensuring reliable jetting even for viscous
materials used in smartphone middle frame bonding.
Q2: How does the valve prevent glue overflow or stringing on narrow
bezel structures?
A2: The non-contact dispensing design and precise jetting control
of the piezo valve allow accurate glue placement, even in frames
with high aspect ratios (>55%). Optimized parameters and
anti-stringing nozzle designs help avoid overflow and residue on
narrow edges.
Q3: How do you ship the goods?
Usually for sample order, we ship by DHL, FedEx, TNT, SF.
For mass order, airline, sea shipping are also optional.
About Mingseal
Founded in 2008, Changzhou Mingseal Robot Technology Co., Ltd. is a
technology-driven manufacturer of high-end equipment, specializing
in connection, assembly, inspection systems, and key components for
advanced semiconductor packaging and precision electronics. Our
solutions are widely adopted by leading customers in sectors such
as semiconductor packaging, consumer electronics, and automotive
electronics. With a strong presence across Asia and the Americas,
we deliver reliable support and innovation globally.
Partner with Mingseal to power the future of automatic
manufacturing!
