TIC800P Low Melting Point Thermal Interface Materials Thermal Phase
Changing Material
The TIC™800P series is low melting point thermal interface material. At 50℃, TIC™800P series begins to soften and flow, filling the microscopic
irregularities of both the thermal solution and the integrated
circuit package surface, thereby reducing thermal resistance.
TIC™800P series is a flexible solid at room temperature and free standing
without reinforcing components that reduce thermal performance.
TIC™800P Series shows no thermal performance degradation after 1,000
hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material
softens and does not fully change state resulting in minimal
migration(pump out)at operating temperatures.
Features
> 0.021℃-in²/W thermal resisitance
> Naturally tacky at room temperature,no adhesive required
> No heat sink preheating required
Applications
> Automotive electronics
> Set top boxes
> Set top boxes
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
| Typical Properties of TIC™800P series |
| Product Name | TIC™805P | TIC™806P | TIC™810P | Test Method |
| Color | Pink | Visual |
| Thickness | 0.005"/0.126mm | 0.008"/0.203mm | 0.010"/0.245mm | ****** |
| Thickness Tolerance | ±0.0008"/±0.019mm | ±0.0008"/±0.019mm | ±0.0012"/±0.030mm | ****** |
| Specific Gravity | 2.2 g/cc | Helium Pycnometer |
| Temperature range | -25 to 125℃ | ****** |
| Phase Change Softening Temperature | 50℃-60℃ | ****** |
| Thermal conductivity | 0.95W/mK | ASTM D5470 |
| Thermal Impedance@50psi | 0.24℃-in²/W 0.15℃-cm²W | 0.053℃-in²/W 0.34℃-cm²W | 0.080℃-in²/W 0.52℃-cm²W | ASTM D5470 |
Standard Thicknesses:
0.005"(0.127mm) ,0.008"(0.203mm), 0.010"(0.254mm)
Consult the factory alternate thickness.
Standard Sizes:
12" x 16"(304.8mm x 406mm) , 12"x400(304.8mm x 121.92m)
TIC800P series are supplied with a white release paper and a bottom
liner.
TIC800P series is available inkiss cut an extended pull tab liner
or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC800P series
products.
Reinforcement:
No reinforcement is necessary.
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting
point thermal interface materials, thermal conductive insulators,
thermally conductive tapes, electrically & thermally conductive
Interface pads and thermal grease,Thermal Conductive
plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials
products, with well-equipped testing equipment and strong technical
force.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it
is 7-10 work days if the goods are not in stock, it is according to
quantity.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just
contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data
sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM
D5470 are utilized to test the thermal conductivity.
