6 inch POD /8 inch POD /FOSB(Fiber Optic Splice Box) /Delivery box/
Storage Box /RSP(Remote Service Platform) /FOUP(Front Opening
Unified Pod)
PRODUCT FEATURES
6inch POD
Complies with SEMI standards
Available in standard and crane models
Compatible with 8-inch SMIF mechanical interface, matches 6-inch &
6.3-inch cassettes online
Optimized handle structure with anti-drop design
Multiple color options available for process management
Customized 6-inch compound semiconductor POD solutions
Transparent or orange box options available
8inch POD
Complies with SEMI standards
Available in standard and crane models
Numerous practical application cases
Transparent or orange box options available
Customization options supported
Multiple color options available for process management
Several proprietary improvements significantly enhance product
reliability
FOSB(Fiber Optic Splice Box)
Complies with SEMI standards
Provides a clean environment for wafer transportation
Capacity: 25 PCS
Highly compatible, suitable for various equipment
Made from ultra-clean materials
Delivery box
Designed for 8-inch wafer shipment
Wide product range covering common types of shipping boxes
Extensive application examples in FABs
Storage Box
Suitable for the transfer and storage of 6-inch and 8-inch manual
line cassettes
Ergonomic handle design on both sides for efficient handling
Optional transparent top cover
Extensive application examples in FABs
RSP(Remote Service Platform)
Compliant with SEMI standards
Supports both N2-purge and non-purge configurations
Superior airtight performance
Multiple patented designs
Extensive application references
FOUP(Front Opening Unified Pod)
Compliant with SEMI standards
Available in PC and water-resistant materials
Capacity options: 25 pcs or 13 pcs
Supports bulk delivery
Features multiple patented designs
Excellent inflation and airtight performance
Compatibility design enables mixed use with other brands
Multifunctional options to support diverse application scenarios
Q and A
Q:What is POD (Process Open/Close Device)?
A:POD (Process Open/Close Device) is a specialized container used in
semiconductor manufacturing and microfabrication processes to
safely store and transport wafers (typically silicon or sapphire)
between different stages of production in a cleanroom environment.
It is designed to protect wafers from contamination by airborne
particles, humidity, or chemical exposure during automated handling
processes.
POD Structure and Components
A POD typically consists of the following parts:
1.Lid – Provides a sealed cover to ensure the wafers are protected
from external contaminants.
2.Base – Holds the wafers in place, with guides or slots to keep
them securely positioned during transport.
3.Locking Mechanism – Ensures that the POD remains airtight when
closed to prevent contamination.
Key Functions of POD
1.Contamination Prevention: The sealed design prevents wafers from
being exposed to airborne particles, moisture, and chemicals.
2.Wafer Protection: Ensures that wafers are not physically damaged
during transport and handling.
3.Automation Compatibility: PODs are compatible with Automatic
Material Handling Systems (AMHS) used in semiconductor fabs to
facilitate automated wafer loading and unloading.
4.Chemical Resistance: Made from high-performance polymers like
PEEK, PFA, or polycarbonate, ensuring durability against corrosive
chemicals used in semiconductor processes.
Applications of POD
PODs are widely used in the following areas:
1.Semiconductor wafer fabrication (silicon, sapphire, glass wafers)
2.MEMS (Micro-Electro-Mechanical Systems) manufacturing
3.Optical device production
4.Research and development laboratories
Advantages of Using POD
1.High sealing performance to maintain a particle-free environment
2.Stackable design to optimize cleanroom storage space
3.Robust construction to protect wafers from mechanical shock
4.Lightweight materials for ease of handling
5.Optional transparent window for visual inspection of the wafers
inside
Future Trends in POD Development
With increasing demand for larger wafer sizes and higher
cleanliness requirements, POD designs are evolving to meet
automation, modularity, and multi-size compatibility needs. Future
PODs are expected to feature smart monitoring systems and real-time
contamination detection to further improve wafer protection and
production efficiency.
Tag:#6 inch POD #8 inch POD #FOSB(Fiber Optic Splice Box) #Delivery
box # Storage Box #RSP(Remote Service Platform) #FOUP(Front Opening
Unified Pod)
