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Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field

    Buy cheap Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field from wholesalers
     
    Buy cheap Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field from wholesalers
    • Buy cheap Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field from wholesalers
    • Buy cheap Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field from wholesalers
    • Buy cheap Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field from wholesalers
    • Buy cheap Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field from wholesalers

    Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field

    Ask Lasest Price
    Brand Name : Suntek Electronics Co., Ltd
    Model Number : 2024-PCBA-128
    Certification : ISO9001 ISO13485 IATF16949 UL
    Price : Customized products
    Payment Terms : TT,Paypal
    Delivery Time : 5-7days after all components kitted
    • Product Details
    • Company Profile

    Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field

    Communication PCB Assembly Rigid PCB 2-40 Layers and Rigid-Flex PCB 1-10 Layers for Advanced Downstream Application Field


    Suntek Contract Factory:

    Suntek Group is a leading supplier in EMS field with one-stop solution for PCB/FPC

    assembly,Cable assembly,Mix technology assembly and Box-buildings.

    Suntek Electronics Co., Ltd,as the major facility, located in Hunan Prov,China;

    BLSuntek Electronics Co., Ltd,as the new facility,located in Kandal Prov,Cambodia.


    Capabilities overview:


    Product NamePCB Assembly
    PCBA TestAOI, X-RAY, ICT, Function Test
    PCB Assembly MethodBGA
    Minimum Hole Tolerance±0.05mm
    Layers2-10
    PCB Thickness0.2-7.0mm
    Surface FinishHASL, ENIG, OSP, Immersion Silver, Immersion Tin
    PCB ProcessImmersion Gold
    PCB Quality SystemROHS
    Min. Line Width/Spacing0.1mm
    Surface FinishENIG

    Communication is the most important downstream application field of PCB. PCB has a wide range of applications in various aspects such as wireless network, transmission network, data communication and fixed network broadband, and it is usually added value such as backplane, high-frequency high-speed board, and multi-layer PCB board. Higher product. 5G is the next generation mobile communication network, and there will be a large amount of infrastructure construction demand by then, which is expected to greatly boost the demand for communication boards.

    Here are the most common applications of the telecommunication industry that make efficient use of PCBs:

    • Wireless communication systems
    • Mobile phone tower systems
    • Telephonic switching systems
    • PBX systems
    • Industrial wireless communication technology
    • Technology for commercial phones
    • Video conferencing technologies
    • Communication technology used in space
    • Cell transmission and tower electronics
    • High speed servers and routers
    • Electronic data storage devices
    • Mobile communication systems
    • Satellite systems and communication devices
    • Video collaboration systems
    • Land wired communication systems
    • Technology for commercial phones
    • Digital and analog broadcasting systems
    • Voice over Internet Protocol (VoIP)
    • Signal boost systems (online)
    • Security technology and information communication systems

    Why is FR-4 still commonly used if industrial PCBs face extreme temperatures?

    While special substrates like polyimides and ceramics handle wider temperature swings, FR-4 laminates have evolved “high Tg” versions usable to 150°C+ along with lower cost and better fabricator familiarity. So FR-4 remains an option for many industrial applications not hitting extreme temps.



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