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Multilayer Rigid HDI PCB Printed Circuit Board Tablet Computer Electronics Manufacturing

    Buy cheap Multilayer Rigid HDI PCB Printed Circuit Board Tablet Computer Electronics Manufacturing from wholesalers
     
    Buy cheap Multilayer Rigid HDI PCB Printed Circuit Board Tablet Computer Electronics Manufacturing from wholesalers
    • Buy cheap Multilayer Rigid HDI PCB Printed Circuit Board Tablet Computer Electronics Manufacturing from wholesalers

    Multilayer Rigid HDI PCB Printed Circuit Board Tablet Computer Electronics Manufacturing

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    Brand Name : TECircuit
    Model Number : TEC0153
    Certification : UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
    Price : USD 1.99 ~ USD9.99/pcs
    Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
    Supply Ability : 50000 pcs/month
    Delivery Time : 5-15 wotk days
    • Product Details
    • Company Profile

    Multilayer Rigid HDI PCB Printed Circuit Board Tablet Computer Electronics Manufacturing

    Product Images


    About TECircuit


    Found: TECircuit has been operating since 2004.

    Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.

    Item: Customizable EMS PCB, offers a full range of one-stop     shop services.

    Service:     Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing,     Box-Building, Testing.

    Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

    Factory Pictures:
    Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2


    Product Applications


    • Main Logic Board:

      • Used in the central processing unit (CPU) and graphics processing unit (GPU) circuits, providing high-density connections for powerful performance.

    • Display Interface:

      • Employed in connections for touchscreens and LCD/LED displays, ensuring high-resolution output and responsiveness.

    • Power Management Systems:

      • Integrated into circuits that manage battery charging, power distribution, and energy efficiency to prolong battery life.

    • Wireless Communication Modules:

      • Used in Wi-Fi, Bluetooth, and cellular connectivity components, ensuring reliable and fast data transmission.

    • Camera Modules:

      • Employed in circuits that support front and rear cameras, enabling high-quality image and video processing.

    • Audio Systems:

      • Integrated into audio amplifier circuits and speaker connections, providing high-quality sound output.

    • Sensors:

      • Used in various sensors, such as accelerometers and gyroscopes, enhancing functionalities like orientation detection and motion sensing.

    • Storage Interfaces:

      • Employed in connections for flash memory storage, ensuring fast data access and transfer rates.

    • Charging Ports:

      • Integrated into USB-C or other charging interfaces, facilitating efficient power transfer and data connectivity.

    • Thermal Management Systems:

      • Used in designs that require effective heat dissipation, maintaining optimal performance during prolonged use.

    Product Features

    1. High Density:

      • HDI (High-Density Interconnect) PCBs allow for compact designs with a high number of components, essential for slim tablet profiles.

    2. Improved Signal Integrity:

      • Shorter traces and optimized routing enhance signal quality, crucial for high-speed data transfer and communication.

    3. Better Thermal Management:

      • Advanced materials and multilayer designs help dissipate heat effectively, preventing overheating during intensive tasks.

    4. Enhanced Routing Flexibility:

      • The use of microvias and buried vias allows for complex circuit layouts, maximizing space efficiency.

    5. Lightweight Design:

      • Reduced material usage contributes to lighter tablet designs, improving portability and user experience.

    6. Cost Efficiency in Mass Production:

      • While initial costs may be higher, HDI PCBs can be cost-effective for large-scale manufacturing due to their performance advantages.

    7. Customizability:

      • Can be tailored to meet specific design requirements, enabling unique layouts and configurations for various tablet models.

    8. Durability:

      • Built to withstand environmental factors, ensuring reliable performance in everyday use.

    9. Regulatory Compliance:

      • Designed to meet industry standards for safety and performance, ensuring dependable operation in consumer electronics.

    10. Ease of Integration:

      • Compatible with a wide range of components, facilitating the incorporation of advanced features and technologies in tablets.

    FAQ

    Question 1: What is needed for a quotation?
    Answer:
    PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
    PCBA: PCB information, BOM,(Testing documents...)

    Q2: What file formats do you accept for production?
    Answer:
    PCB Gerber file
    BOM list for PCB
    Test method for PCBA

    Q3: Are my files safe?
    Answer:
    Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

    Q4: What is the shipment method?
    Answer:
    We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

    Q5: What is the payment method?
    Answer:
    Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

    ​Product Description​

    Specification:
    PCB layers:1-42layers
    PCB materials:CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
    PCB max. board size:620mm*1100mm
    PCB certificate:RoHS Directive-Compliant
    PCB Thickness:1.6 ±0.1mm
    Out Layer Copper Thickness:0.5-5oz
    Inner Layer Copper Thickness:0.5-4oz
    PCB max. board thickness:6.0mm
    Minimum Hole Size:0.20mm
    Minimum Line Width/Space:3/3mil
    Min. S/M Pitch:0.1mm(4mil)
    Plate Thickness and Aperture Ratio :30:1
    Minimum Hole Copper:20µm
    Hole Dia. Tolerance(PTH):±0.075mm(3mil)
    Hole dia. Tolerance(NPTH):±0.05mm (2mil)
    Hole Position Deviation:±0.05mm (2mil)
    Outline Tolerance:±0.05mm (2mil)
    PCB solder mask:Black, white, yellow
    PCB surface finished:HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
    Legend:White
    E-test:100% AOI, X-ray, Flying probe test.
    Outline:Rout and Score/V-cut
    Inspection Standard:IPC-A-610CCLASSII
    Certificates:UL (E503048),ISO9001/ISO14001/IATF16949
    Outgoing Reports:Final Inspection, E-test, Solderability Test, Micro Section and More
    Product Tags:

    Multilayer Rigid HDI PCB Board

      

    Electronics Manufacturing Rigid HDI PCB

      

    Computer Manufacturing Printed Circuit Board

      
    Quality Multilayer Rigid HDI PCB Printed Circuit Board Tablet Computer Electronics Manufacturing for sale

    Multilayer Rigid HDI PCB Printed Circuit Board Tablet Computer Electronics Manufacturing

    Company Info.
    Shenzhen Tecircuit Electronics Limited
    Verified Supplier
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