Features:
Compatibility:
The JEDEC trays have been specifically designed and manufactured to
fit seamlessly with standard handling and testing equipment. They
are readily compatible with pick-and-place machines which greatly
streamlines the manufacturing process.
Reusability:
The JEDEC trays have been designed for multiple uses, making them
an excellent cost-effective and environmentally friendly solution
for semiconductor packaging. Their reusability minimizes waste and
lowers operational costs.
Customizability:
While there are standard designs available for JEDEC trays, some
manufacturers offer additional customization to accommodate
specific device shapes or sizes. This provides flexibility in the
manufacturing process and ensures that the trays can be tailored to
meet individual requirements.
| HN PN. | Description | External Size/mm | Pocket Size/mm | Matrix QTY |
| HN23116 | NEW-R2-2573-COD | 322.6x135.9x7.62 | 22.5*22.18*2.98 | 4X11=44PCS |
| TYPE | Brand | Flatness | Resistance | Service |
| BGA IC | Hiner-pack | MAX 0.76mm | 1.0x10e4-1.0x10e11Ω | Accept OEM,ODM |
Technical Parameters:
The JEDEC TRAY structure and shape conforms with international
standards, which not only satisfies the requirements for carrying
electronic components and various packaging ICs, but also aligns
with the needs for automatic feeding system by customers, matching
automation equipment for loading with ease and delivering efficient
work efficiency.
At Hiner-pack, our customized JEDEC TRAY is designed to 100% meet
your IC's specifics, providing tailored protection solutions based
on its chip packaging. Our website showcases our range of JEDEC
TRAY designs for multiple packaging type, including but not limited
to BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and others. We can
deliver effective design solutions and effective wafer-level
package protection for your products.
Applications:
JEDEC trays are a crucial element in the semiconductor industry due
to their ability to guarantee secure and efficient handling of
fragile electronic parts. The trays have extensive applications
which include:
- Semiconductor manufacturing and assembly
- Electronic component testing
- Shipping and storage of sensitive devices, for instance, integrated
circuits (ICs)
JEDEC trays are useful in safeguarding the delicate components
during shipping and storage. They are also essential in ensuring
that the electronic parts are well-positioned during component
testing and semiconductor manufacturing and assembly process.
Packing and Shipping:
Product Packaging:
- The custom JEDEC trays will be packaged in a sturdy cardboard box
to ensure safe transportation.
- The trays will be packed securely with bubble wrap or foam to
prevent any damage during transit.
- Each box will contain a specified number of trays based on the
customer's order.
- The box will be clearly labeled with the product name, quantity,
and any necessary handling instructions.
Shipping:
- Shipping will be arranged by our team and will be in accordance
with the customer's preferred method and location.
- We offer a range of shipping options including standard, express,
and overnight delivery.
- The customer will be provided with a tracking number to monitor the
progress of their shipment.
- If any issues arise during shipping, our customer service team will
work to resolve them promptly.
