High Temperature And Waterproof Insulation Thermal Conductive Glue
TIETM280-15AB Series is a two compound, high thermal conductive, low temperature cured,
long pot life,fire resistant silica encapsulant glue. It is design for potting of capacitors and electrical devices.Their
flexibility and elasticity make them suited to the coating of the
very uneven surfaces.Heat can transmit to the metal housing or
dissipation plate from the separate elements or even the entire
PCB, which in effect enhances the efficiency and life-time of the
heat-generating electronic components.
TIE280-15AB-Series-Datasheet (1).pdf
Feature
> Good thermal conductive: 1.5W/mK
> Excellent insulation and smoothly sourface.
> Low shrinkage
> Low viscosity, expediting air releaseed.
> Excellent in solvents and water proof.
> Longer life time.
> Excellent thermal shock efficiecy and impact resistance
Applications
> Automotive starters potting; General potting;
> Thermal detector potting
> Ferrite adhesion; TIP type LED; Good adhesion toaromatic
polyester
> Relay sealant;Good adhesion to rubber, ceramics,PCB and
plastics
> Power transformers and coils; Potting capacitors;Potting of
small electrical devices
> Adhesion to metal glass and plastic;LCD & substrates adhesion;
> Coating and sealant; Coil ; IGBTS;Transformer; Fire retardant
> Optical / medical component adhesive
| Typical Properties of TIETM280-15AB Series |
| Typical Uncured Material |
| TIETM280-15A(Resin) | Mixing ratio (weight ratio)
A:=1 :1 |
| Color | Black |
| Viscosity @25℃ Brookfield | 15000 cPs | Viscosity @25℃ Brookfield | 10000 cPs |
| Operating time (@25℃) | 45 mins |
| Shelf life @25℃ in sealed | 12 months | specific Gravity | 1.6 g/cc |
| Mixture Color | Black |
| TIETM280-15B(Hardener) | Cure Schedule |
| Color | Black | Cure at 25C | 3 hrs |
| Viscosity @25℃ Brookfield | 7000 cPs |
| Shelf life @25℃ in sealed container | 12 months | Cure at 7o°c | 30 mins |
| Cured Properties |
| Hardness @25℃ | 85 Shore D |
| Operating temperature | -40℃ ~160℃ |
| Glass transition temperature Tg | 92℃ |
| Rate of tension | 0.001 |
| Coefficient of thermal expansion, /℃ | 3.0x 10^(-5) |
| Fire resistance uL | 94 V-0 |
| Moisture absorption % wt gain 24 hours water immersion @25℃ | <0.1% |
| Thermal Conductivity | 1.5 W/m-K |
| Dielectric Breakdown Voltage | 300 volts / mil |
| Dielectric Constant@1MHz | 4.2 |
| volume resistivity, ohm-cm @ 25℃ | 3.0x 10^13 |
Package:
1KG A/B for each tank. 5KG A/B each. 10KG A/B each.
Comapny Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting
point thermal interface materials, thermal conductive insulators,
thermally conductive tapes, electrically & thermally conductive
Interface pads and thermal grease,Thermal Conductive
plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials
products, with well-equipped testing equipment and strong technical
force.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team,
engineering team, R&D team, Manufacturing team, logistics team.
All is for supporting and servicing a satisfy service for
customers.
