Product Description:
But what really sets our Ceramic Heat Sink apart is its exceptional
heat dissipation capabilities. Made from a highly thermally
conductive material, our heat sink is designed to efficiently
transfer heat away from your components, helping to keep them cool
and extend their lifespan. And with a density of 3.7g/cm^3, our
heat sink is both lightweight and durable, perfect for use in a
variety of applications.
And don't forget about the convenience of our included thermally
conductive adhesive tape with pull tab for direct IC surface mount.
With this tape, you can easily and securely attach our heat sink to
your components without the need for messy or time-consuming
installation methods. Plus, our tape is non-electrically
conductive, meaning you won't have to worry about any interference
or "antennae effect" when using our product.
So if you're in need of a reliable and high-performing heat sink
solution, look no further than our Ceramic Heat Sink. With its
exceptional heat dissipation capabilities, durable construction,
and convenient installation options, it's the perfect choice for a
wide range of applications.
Features:
- Product Name: Ceramic Heat Sink
- Density: 3.7g/cm 3
- Material: Ceramic, Silicon carbide (SiC), Aluminum oxide (Al₂O₃),
Silicon dioxide (SiO₂), Aluminum carbide (Al₄C₃)
- Size: Various Sizes Available
- Surface Roughness: 0.3-08 Um
- Durability: Long-lasting
- Features: Ceramic Micro Porous
Technical Parameters:
| Technical Parameters | Description |
|---|
| Heat Dissipation | Efficient |
| Thermal Conductivity | 9~180 MW/m.K |
| Weight | Lightweight |
| Mechanical Strength | ≥3000MPa |
| Color | Green,Black,White,Gray |
| Application | Transistor, MOSFET, Schottky Diode, IGBT, High-density Switching
Power Supply, High-frequency Communication Signal Equipment, High
Frequency Welding Machines And Other Electronic Devices |
| Durability | Long-lasting |
| Surface Roughness | 0.3-08 Um |
| Material | Ceramic, SiC , Al₂O₃ , SiO₂,Al₄C₃ |
| Size | Various Sizes Available |
| Additional Features | With and without thermally conductive Silicone adhesive tape, No
antennae effect, Large surface area compared to Aluminium Heat
Sinks |
Applications:
Race Ceramic Heat Sink is a product that is designed to provide
good thermal conduction and low thermal expansion coefficient. It
is made of high-quality ceramic materials such as Al₂O₃, SiO₂, SiC,
and Al₄C₃ that ensures high reliability and durability. The product
is manufactured in China, and it has been certified with ISO9001,
ISO14001, and TS16949.
The Race Ceramic Heat Sink is an ideal solution for electronic
devices that require high-density switching power supply,
high-frequency communication signal equipment, high-frequency
welding machines, and other electronic devices. The heat sink is
suitable for use with various electronic components such as
transistors, MOSFET, Schottky diode, IGBT, and more. It can also be
used for heat dissipation in power electronics, automotive
electronics, and aerospace applications.
The Ceramic Heat Sink is known for its low cost and high
reliability. It has a surface roughness of 0.3-08 Um and a warpage
of ≤2‰. Its temperature resistance is ＜700℃, which is ideal for
high-temperature applications. The minimum order quantity for the
product is low, and the price is negotiable.
The packaging details for the Race Ceramic Heat Sink are as per
customer requirements, and the delivery time is 7-15 days. The
payment terms are 30% TT in advance, and the balance payment is
paid before shipment.
