Package Suitable For Various Packaging Simulation Experiments

Description:

1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation.

2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized.

3. Key process feasibility simulation analysis from wafer level to package level.

4. Package reliability simulation verification under external load environment such as heat and force.

Competitive Advantage:

1. Verify the process model and electrical and mechanical model

2. Using the model to predict the behavior of the product under the actual environment

Guangdong Fozhixin (FZX）microelectronic technology research Pte Ltd was registered in Foshan city, Guangdong province of PRC, 2018. FZX was focus on panel level packaging technology development and mass production. At present, FZX has a factory which was about more than 2000 meter square. In addition, there is another mass production site being built up with more than 5000 meter square in Foshan city as well. MOS chip package, GaN package and LED/driver one package, etc. are major products that are shipped to the final customers. FZX also delivered the glass core substrate to the customers and owned the mass production capability with more than 3000 glass panels (size with 510mmX 515mm) output per month. FZX has own more than 180 IPs that were ranked No.4 world wide in fan-out field. FZX is a leading OSAT on panel level packaging (PLP) and provides engineering and mass production service for more than 100 customers of global market. Trust and delight customers are always company core culture and value. It is always a great honour to serve you and make you better.