Sapphire Substrate, Sapphire Wafer, Sapphire Singal Crystal Wafer,
Al2O3 wafer, High-Purity Al2O3 substrate, High-Hardness wafer,
High-Performance Sapphire wafer, Al2O3 Single Crystal Wafer
Features of Sapphire Wafer
· Crafted from synthetic sapphire with an aluminium oxide (Al₂O₃)
purity of 99.999%.
· Boasts a Mohs hardness rating of 9.0, ensuring superior scratch
resistance and durability.
· Offers 85% visible light transmissivity, providing exceptional
clarity and visibility.
· Supports customization based on provided design drawings.
· Delivers high performance, even in challenging and harsh
environments.
*This is the high thickness sapphire wafer (12inch)
About 12inch Sapphire Wafer
Manufacturing 12-inch wafers is more difficult due to challenges in
crystal growth, cutting, polishing, equipment limitations, yield
issues, and quality control.
This complexity makes 12-inch wafers less common and more expensive
compared to 4-inch, 6-inch, and 8-inch wafers.
Here are 4 points about why they are the most difficult ones.
1. Crystal Growth: It is very hard to maintain the uniformity of so
large crystal while the small fluctuations in temperature and
chemical composition can impact the quality.
Besides, larger crystals have a higher likelihood of internal
defects such as dislocations and stress concentrations, which are
harder to manage.
2. Processing Challenges: Cutting and grinding larger wafers
require higher precision equipment and techniques. Any minor errors
are magnified, leading to a higher defect rate.
Also, Polishing larger wafers takes more time and precision to
ensure surface smoothness and consistent thickness.
3. Equipment and Cost: Manufacturing 12-inch wafers necessitates
larger, more sophisticated equipment, leading to higher initial
investment and maintenance costs.
In addition, Due to the increased difficulty and higher defect
rates, the production cost for 12-inch wafers is significantly
higher than for 8-inch and 6-inch wafers.
4. Thermal Treatment and Stress: Larger wafers are more prone to
stress during thermal treatment, which can cause warping or
cracking.
Furthermore, maintaining temperature uniformity during thermal
processes is more challenging for larger wafers, affecting the
final quality.
To sum up, the 12-inch sapphire wafers are the hardest ones to
manufacture.
Other details of sapphire wafer
| Property | Specification |
| Name | Sapphire parts |
| Size | Customized |
| Density, g/cm3 | 3.98 |
| Hardness (Mohs) | 9 |
| Melting point, °K | 2050 |
| Surface Flatness | λ/4 @ 633 nm |
| Young's modulus | 3.4 x 1011 N m-2 |
| Thermal Limit | 22 W m-1 K-1 |
| Thermal expansion coefficient | 8.4 x 10-6 K-1 |
| Surface Quality | 40-20 scratch-dig |
| Crystal class | Hexagonal system, rhomboidal class 3m |
| Optical transmission range, µm | 0.17 - 5.5 |
| Refractive index at 0.532 µm | n0=1.7717, ne=1.76355 |
| Surface Quality | 40-20 scratch-dig |
More samples of sapphire wafer
*Also, we accept the customization if you have more requirements
