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Dark Gray Zirconia Ceramic Substrate: High-Precision, High-Temperature Resistant Rectangular Insulation Substrate

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Dark Gray Zirconia Ceramic Substrate: High-Precision, High-Temperature Resistant Rectangular Insulation Substrate

Dark Gray Zirconia Ceramic Substrate: High-Precision, High-Temperature Resistant Rectangular Insulation Substrate

Product Introduction
This product is a dark gray rectangular substrate made from high-purity zirconia ceramic, featuring a mirror-smooth surface achieved through precision polishing and an integrally molded raised border structure along the edges. The product fully utilizes the excellent thermal stability and electrical insulation properties of zirconia material, achieving multifunctional integration through unique structural design. Its balanced mechanical properties and outstanding corrosion resistance make it an ideal choice for high-precision industrial applications.

Core Advantages
• Excellent high-temperature resistance: Maximum service temperature up to 1500°C with exceptional structural stability at high temperatures
• Outstanding insulation characteristics: Volume resistivity >10¹⁵ Ω·cm, dielectric strength >15 kV/mm
• High strength and toughness: Flexural strength ≥900 MPa, fracture toughness ≥8 MPa·m¹/²
• Low thermal conductivity: Thermal conductivity 2-3 W/(m·K), providing effective thermal insulation
• Superior corrosion resistance: Resistant to acids, alkalis, and oxidation, suitable for harsh industrial environments

Specifications Table

ParameterTechnical Specification
MaterialHigh-Purity Zirconia Ceramic
StructureRectangular with Border
ColorDark Gray
Density6.0-6.1 g/cm³
Flexural Strength≥900 MPa
Fracture Toughness≥8 MPa·m¹/²
Maximum Service Temperature1500°C
Volume Resistivity>10¹⁵ Ω·cm
Thermal Conductivity2-3 W/(m·K)
Surface RoughnessRa≤0.1 μm

Manufacturing Process
Zirconia powder pretreatment → Granulation forming → Isostatic pressing → High-temperature sintering → Precision machining → Border forming → Surface polishing → Laser inspection → Performance testing → Cleaning and packaging

Usage Instructions

  1. Ensure the contact surface is clean and flat during installation to avoid impurities affecting heat dissipation

  2. Recommended to use special thermal conductive adhesive for bonding to ensure heat transfer efficiency

  3. Do not exceed the rated maximum operating temperature

  4. Avoid collision with hard objects to prevent edge damage

  5. Regularly clean the surface to maintain optimal insulation performance

After-Sales Service
We provide 24-month product quality guarantee with professional technical team support for application solutions. Customer service files are established for regular usage tracking. Emergency technical issues receive responses within 12 hours and solutions within 48 hours.

FAQ
Q: What is the main function of the border design?
A: Enhances structural strength, provides installation positioning reference, and serves anti-slip and protective functions.

Q: What are the advantages compared to alumina ceramic substrates?
A: Higher strength and toughness, better high-temperature resistance, and longer service life.

Q: Can metallization treatment be performed?
A: Yes, we provide metallization treatments such as gold and silver plating to meet electronic packaging requirements.



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