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99 Alumina Ceramic Substrate Effective Heat Dissipation And Dimensional Stability For Power Electronics And LED Lighting

    Buy cheap 99 Alumina Ceramic Substrate Effective Heat Dissipation And Dimensional Stability For Power Electronics And LED Lighting from wholesalers
     
    Buy cheap 99 Alumina Ceramic Substrate Effective Heat Dissipation And Dimensional Stability For Power Electronics And LED Lighting from wholesalers
    • Buy cheap 99 Alumina Ceramic Substrate Effective Heat Dissipation And Dimensional Stability For Power Electronics And LED Lighting from wholesalers

    99 Alumina Ceramic Substrate Effective Heat Dissipation And Dimensional Stability For Power Electronics And LED Lighting

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    99 Alumina Ceramic Substrate Effective Heat Dissipation And Dimensional Stability For Power Electronics And LED Lighting

    Alumina Ceramic Substrate Effective Heat Dissipation And Dimensional Stability For Power Electronics And LED Lighting


    Alumina ceramic substrate (Al₂O₃ ceramic substrate) is an electronic ceramic material composed of 96%-99.9% aluminum oxide, offering excellent insulation properties, high thermal conductivity and good mechanical strength. As a crucial carrier for electronic components, it is widely used in power electronics, LED packaging, integrated circuits and other fields. Its unique properties make it an indispensable fundamental material for modern electronic devices.

    Main Applications

    • Power Electronics: IGBT module substrates, MOSFET heat dissipation substrates

    • LED Lighting: COB packaging substrates, high-power LED carriers

    • Integrated Circuits: Thick film circuit substrates, thin film circuit carriers

    • Sensors: Pressure sensor substrates, temperature sensing elements

    • Microwave Communication: RF device substrates, antenna array base materials

    Core Advantages

    Superior Insulation: Dielectric strength >15kV/mm, volume resistivity >10¹⁴Ω·cm
    Excellent Thermal Conductivity: 20-30W/(m·K) thermal conductivity for effective heat dissipation
    High Strength & Durability: Flexural strength >300MPa, Mohs hardness 9
    Dimensional Stability: CTE 7-8×10⁻⁶/℃ matching semiconductor materials
    Environmental Resistance: High temperature, corrosion and aging resistance

    Technical Specifications

    ParameterStandard Value
    Al₂O₃ Content96%/99%/99.6%
    Thickness Tolerance±0.05mm
    Surface RoughnessRa≤0.2μm
    Thermal Conductivity (25℃)24-30W/(m·K)
    Dielectric Constant (1MHz)9.2-9.8
    Flexural Strength280-350MPa

    Manufacturing Process

    1. Powder Preparation: Fine grinding of high-purity alumina powder

    2. Tape Casting: Precision thickness control ±1%

    3. High-Temperature Sintering: 1600-1700℃ atmosphere protection sintering

    4. Laser Cutting: Precision ±0.02mm

    5. Surface Treatment: Double-side polishing to Ra0.1μm

    6. Strict Testing: 100% electrical performance testing

    Usage Guidelines

    1. Recommended soldering temperature below 850℃

    2. Avoid mechanical impact and local stress concentration

    3. Storage environment humidity <60%RH

    4. Consider thermal expansion matching when assembling with metal parts

    5. Surface metallization recommended for high-frequency applications

    After-Sales Service Commitment

    • Professional technical support and selection guidance

    • 48-hour rapid response mechanism

    • Small batch samples available (MOQ 50pcs)

    • Third-party test reports provided (SGS/CNAS)

    FAQ

    Q: How to choose different alumina contents?
    A: 96% for conventional electronics; 99% for high thermal conductivity needs; 99.6% for high-frequency precision circuits

    Q: What is the maximum processable size?
    A: Standard size 150×150mm, maximum up to 200×200mm

    Q: Are special shapes supported?
    A: Laser precision cutting service available, minimum hole diameter 0.1mm

    Q: What metallization options are available?
    A: Various solutions including gold plating, silver plating, and copper plating



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    Circle Alumina Products

      
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