Customized Metal 6 8 12 inch Semi Wafer Dicing Frame Ring Metal
Ring Wafer Frame
6" 8" 12" High Quality Custom Wafer Frame Dicing Ring for
Semiconductor Industry
This wafer ring with its high-quality aluminum alloy material,
precise processing technology, and strict quality control, has
reached industry-leading levels in durability, positioning
accuracy, and safety of use.
Semi-Wafer Cutting Frame Ring
(1)This wafer dicing frame is made of high quality aluminum alloy
for excellent durability and stability. Precision-machined slots
reliably hold the 6-inch wafer in place, ensuring positional
accuracy during cutting and transportation.
(2)The lightweight design facilitates handling and provides good
anti-static protection, suitable for the semiconductor and
electronics industry processes.
| Outline Size | 6.8.12 INCH | Brand | Hiner-pack |
| Material | Metal | Flatness | <0.3mm |
| Color | Silver | Service | Accept OEM,ODM |
| RA | <0.5 | Surface Glossiness | >80GS |
Why Do We Choose Wafer Frame Flex Rings?
1.Material
The taut ring is mainly made of high-strength aluminum alloy, with
excellent resistance to deformation and corrosion resistance.
Individual models are also made of stainless steel to further
improve wear resistance.
2.Sizes
The standard size of the bandage ring includes 6 inches, 8 inches
and 12 inches, etc., can be applied to different specifications of
the wafer. Each size of the bandage ring has a corresponding outer
diameter and inner diameter size, to ensure a perfect match with
the process equipment.
3. Structural design
The taut ring adopts patented multi-stage structure, which improves
the overall rigidity and stability.
Precision positioning slots are provided inside to reliably fix the
wafers and prevent them from shifting during transportation.
The surface is anodized to provide good anti-static and wear
resistance.
4. Performance indicators
The maximum load capacity of the ring is up to 20kg, which is
sufficient to support the weight of large-sized wafers.
Can withstand -40 ° C to 125 ° C working temperature range,
suitable for all kinds of semiconductor manufacturing environment.
Conforms to SEMI international standards, ensuring full
compatibility with mainstream equipment in the industry.
5.Production process
High-precision CNC machining and automated assembly processes are
used to ensure product consistency and quality stability.
Each batch of products has to go through strict quality inspection
and function test before leaving the factory.
Certificates and patents:
1. ISO 9001 Quality Management System Certification
2.SEMI Standard Certification
3. ESD (electrostatic discharge) protection level certification
4.RoHS Certification
5.CE certification
