Laptop Phase Change Material CPU Thermal Phase Change Material For
Power Conversion Equipment
Products description
TIC®800K Series is a high thermal conductivity and high dielectric
constant insulating pad. It consists of a polyimide film substrate
coated with a low-melting-point phase change material filled with
ceramic blend. At 50°C, the material surface begins to soften and
flow, effectively filling microscopic surface irregularities
between the heat sink and the integrated circuit board, thereby
reducing thermal resistance and enhancing heat transfer efficiency.
Feature:
> The surface is relatively soft and has good heat conductivity
> Good dielectric strength
> High-voltage insulation, low thermal resistance
> Anti-tear, anti-puncture
Application:
> Power conversion equipment
> Power semiconductors, MOSFETs, and IGBTs
> Audio and video components
> Automotive control units
> Motor controllers
> General high voltage interface
| Typical Properties of TIC®800K series |
| Product Name | TIC®805K | TIC®806K | TIC®808K | Test Method |
| Color | Light Amber | Visual |
| Composite Thickness | 0.004"/0.102mm | 0.005"/0.127mm | 0.006"/0.152mm | ASTM D374 |
| MT Kapton ® Thickness | 0.001"/0.254mm | 0.001"/0.0254mm | 0.002"/0.0508mm | ASTM D374 |
| Total Thickness | 0.005"/0.127mm | 0.006"/0.152mm | 0.008"/0.203mm | ASTM D374 |
| Specific Gravity | 2.0 g/cc | ASTM D792 |
| Specific heat volume(J/g·K) | 1 | ASTM C351 |
| Tensile Strength (MPa) | ≥110 | ASTM D412 |
| Recommended Operating Temp (℃) | -45 ~ 125 | Ziitek Test Method |
| Dielectric Breakdown Voltage(VAC) | >5000 | ASTM D149 |
| Dielectric Constant @1MHz | 1.8 | ASTM D150 |
| Volume Resistivity (Ohm.cm) | 3.5x1014 | ASTM D257 |
| Thermal conductivity (W/mK) | 1.6 W/mK | ASTM D5470 |
| Thermal Impedance (℃·in²/W)@50psi | 0.12 | 0.13 | 0.16 | ASTM D5470 |
Standard Thicknesses: 0.005"(0.127mm) 0.006"(0.152mm) 0.008"(0.203mm) For other
thickness options, please contact us.
Standard Sizes: 10" x 100'(254mm x 30M) Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive: Not applicable to TIC®800K series products.
Reinforcement: TIC®800K series is reinforced with polyimide film.
Company profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting
point thermal interface materials, thermal conductive insulators,
thermally conductive tapes, electrically & thermally conductive
Interface pads and thermal grease,Thermal Conductive
plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials
products, with well-equipped testing equipment and strong technical
force.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality
control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just
contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data
sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM
D5470 are utilized to test the thermal conductivity.
