ESD Factory Circuits QFP QFN Plastic Molded Electronic Parts
Packaging Tray
Built to global JEDEC standards, our trays offer repeatable
performance, high dimensional accuracy, and long-term reliability.
Designed to meet the rigorous demands of modern semiconductor and
electronics manufacturing, the JEDEC matrix tray delivers
dependable performance in automated and manual environments. Made
from high-performance, ESD-safe material, it ensures component
protection from electrostatic discharge and physical damage.
Precision-molded pockets securely hold each unit in place, while
integrated alignment features simplify setup on conveyors, feeders,
and robotic systems. With its robust structure and compatibility
across JEDEC-standard processes, this tray helps manufacturers
reduce error rates and improve process consistency across the
board.
Features & Benefits:
• JEDEC-Compliant Design: Universally compatible with
JEDEC-standard handling systems, reducing integration costs and
setup time.
• ESD-Resistant Material: Built with conductive polymers that
dissipate electrostatic charges to protect sensitive components.
• Secure Component Seating: Molded cells prevent device shifting
during transit, handling, or pick-and-place operations.
• Optimized for Automation: Chamfered corners, flat pocket bottoms,
and pick-up recesses enable seamless use with vacuum tools and
automated handling.
• Rugged & Reusable: Designed to withstand high-throughput usage
cycles in industrial environments without deformation or cracking.
• Stackable with Stability: Stacking features align trays precisely
and prevent sliding, supporting safe and space-efficient vertical
storage
Technical Parameters:
| Product Name | JEDEC Matrix Trays | Number of Lids | Multiple |
| Labeling | Printed | Moisture Resistant | Yes |
| Lid Type | Snap-On | Lid Material | MPPO |
| Lid Color | Black (Based On Customer Needs) | Shape | Rectangular |
| Stackable | Yes | Number of Compartments | Multiple |
Application:
This tray is well-suited for processes including device testing,
SMT component placement, IC packaging, and logistics. Its
structural rigidity and dimensional consistency make it ideal for
systems requiring tight tolerances, including robotic
pick-and-place arms and vacuum feeders. It is used widely in
industries such as microelectronics, photonics, communications, and
automotive electronics, where part protection and process
uniformity are essential.
Customization:
Various customization options are available to support specialized
workflows and proprietary component shapes:
• Pocket Layout Adjustments: Customize pocket depth, width, and
geometry to fit unique package types or irregular device forms.
• Color Variations: Use distinct ESD-safe color materials for part
categorization, production tracking, or process segregation.
• Molded Identifiers: Integrate permanent raised codes,
customer-specific marks, or internal tracking indicators into the
tray during manufacturing.
• Feature Modifications: Add mechanical locating features, altered
support structures, or specialized vacuum access points to suit
unique automation or transport setups.
