2inch Sapphire Substrate Wafer High Purity Al2O3 99.999% DSP
Diameter 50.8mm
Product Description
Sapphire Substrate is a premium-grade single-crystal carrier made
from Al2O3 material, known for its exceptional quality and superior
properties. It is specifically designed to meet the stringent
requirements of high-end optical, optoelectronic, and semiconductor
device applications.
One key feature of the Sapphire Substrate is its ultra-low Total
Thickness Variation (TTV) of less than 5 μm. This remarkable TTV
ensures uniformity and precision in thickness across the entire
substrate, providing a highly stable and reliable platform for
various manufacturing processes.
The Sapphire Substrate is available in two orientations: C-plane
and M-plane. The C-plane orientation offers excellent parallelism,
with a tight parallelism specification of 3 arcsecs. This
parallelism ensures precise alignment and compatibility with
optical systems, enabling optimal performance and accuracy in
optical applications.
For applications that require a different crystal orientation, the
M-plane Sapphire Substrate is available as an alternative. The
M-plane orientation offers unique crystallographic properties that
can be advantageous for specific device designs and performance
requirements.
Sapphire Substrate is widely used in the production of sapphire
windows and sapphire wafers. Its exceptional properties, including
high hardness, excellent optical transparency, and resistance to
chemical corrosion, make it an ideal choice for demanding
applications.
Product parameter
| Properties | Target | Tolerance |
| Diameter | 50.8mm | ± 0.1mm |
| Thickness | 430μm | ±15μm |
| Surface orientation of C-plane | off C-axis to M0.2° | ± 0.1° |
| Primary flat length | 16mm | ±11mm |
| Primary flat orientation | A-plane(11-20) | ±0.1° |
| Back side Roughness | 0.8~1.2um | |
| Front side Roughness | <0.3nm |
| Wafer edge | R-type |
| Total Thickness Variation, TTV | ≤ 10μm(LTV≤5μm,5*5) |
| SORI | ≤10μm |
| Bow | -10 μm ≤ BOW ≤ 0 |
| Laser Mark | N/A |
| Package | 25 wafers in one cassette | |
| Trace ability | Wafers shall be traceable with respect to cassette number | |
Product Display
Packing and Shipping
Package and Shipment of Sapphire Substrates
To ensure the safe and secure transportation of sapphire
substrates, they are meticulously packed using appropriate
packaging materials. The substrates are typically placed in clean
and secure plastic containers designed specifically for this
purpose. These containers are clearly labeled with essential
details such as the product name, quantity, and dimensions.
To maintain the pristine condition of the substrates and safeguard
them from contaminants, the containers are sealed with a plastic
cover. This protective cover prevents the entry of dust, dirt, and
other particles that could potentially compromise the quality of
the substrates.
For optimal protection during transit, the plastic containers are
carefully placed within corrugated cardboard boxes. These boxes are
chosen for their sturdy construction and ability to withstand
handling and transportation stresses. The cardboard boxes are
prominently marked with the customer's shipping address, the
product name, and the number of containers enclosed. Additionally,
the dimensions of the box are clearly indicated on the exterior to
facilitate easy identification and handling.
Once the sapphire substrates are securely packaged, they are
entrusted to a reputable shipping company responsible for their
transportation to the designated destination. The shipping company
assumes the responsibility of ensuring the timely and safe delivery
of the substrates. However, any additional fees associated with the
shipping, such as customs duties or import taxes, are typically the
responsibility of the customer or the recipient of the products.
By employing meticulous packaging techniques and relying on
reliable shipping partners, the packaging and shipping process for
sapphire substrates aims to safeguard their integrity and ensure
they reach their destination in optimal condition, ready for use in
various high-end applications.
