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TO63-03A Hermetic Sealing Package for Power Devices

    Buy cheap TO63-03A Hermetic Sealing Package for Power Devices from wholesalers
     
    Buy cheap TO63-03A Hermetic Sealing Package for Power Devices from wholesalers
    • Buy cheap TO63-03A Hermetic Sealing Package for Power Devices from wholesalers

    TO63-03A Hermetic Sealing Package for Power Devices

    Ask Lasest Price
    Brand Name : HUONA
    Model Number : top
    Certification : ISO9001
    Price : Bargain
    Payment Terms : T/T
    Supply Ability : 100000 A WEEK
    Delivery Time : A WEEK
    • Product Details
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    TO63-03A Hermetic Sealing Package for Power Devices

    Product Overview

    Product Name: TO63-03A Hermetic Sealing Package
    Model Number: TO63-03A
    Package Type: TO-style metal can (Transistor Outline)
    Sealing Technology: Glass-to-Metal Sealing (GTMS)
    Materials:

    • Housing: Kovar alloy (Fe-Ni-Co) or stainless steel

    • Pins: Kovar, Dumet, or custom conductive materials

    • Insulation Medium: Borosilicate or high-insulation glass


    Key Features & Advantages

    • Excellent hermeticity with leak rate ≤1×10⁻⁸ atm·cc/sec (helium leak test), suitable for aerospace, defense, and high-reliability applications

    • Wide temperature range from -55°C to +300°C for use in extreme environments

    • Strong mechanical structure with high resistance to vibration and shock

    • Effective thermal path through the TO-style metal base, ideal for power components and heat-sensitive devices

    • Full customization available: pin configuration, plating thickness, housing size, materials, etc.


    Technical Specifications (Customizable)

    ItemSpecification / Range
    Housing MaterialKovar alloy or 304 stainless steel
    Number of Pins3 pins (customizable to 4, 6,8 etc.)
    Plating OptionsNickel, Gold (0.5–2μm thickness)
    Glass InsulatorBorosilicate or high-insulation custom glass
    Hermeticity≤1×10⁻⁸ atm·cc/sec (He leak test)
    Operating Temp.-55°C to +300°C
    Surface FinishNickel plated, gold plated, or blackened
    Dimensional CustomizationAvailable upon customer drawings
    PackagingVacuum sealed, anti-static bag, foam tray

    Application Fields

    • Laser diode and VCSEL packaging

    • Infrared sensor and detector modules

    • Power electronics: IGBT, MOSFET, and high-current transistors

    • RF and microwave device packaging

    • Medical sensor modules requiring hermetic enclosures

    • Aerospace, defense, and industrial electronics


    Available Documentation & Support

    • 2D/3D drawings in PDF or STEP format

    • Helium leak and material composition reports

    • RoHS and REACH compliance certificates

    • OEM/ODM customization available from prototype to volume

    • Technical consulting for packaging layout, sealing process, and thermal design

    • Our R & D department design your product following your own specifcations

      to Type RF Insulator DC Insulator and Pin Connector for Civil Use
      to Type RF Insulator DC Insulator and Pin Connector for Civil Use
      to Type RF Insulator DC Insulator and Pin Connector for Civil Use


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