In the fast-paced world of electronics, the demand for
high-performance printed circuit boards (PCBs) is paramount. Our
4-layer PCB, constructed from Rogers RO3010, is specifically
designed to excel in RF and microwave applications.
Material Selection: Rogers RO3010
At the heart of this PCB is Rogers RO3010, a high-performance
laminate known for its exceptional electrical and mechanical
properties. This ceramic-filled PTFE composite is engineered for
commercial microwave and RF applications, providing a stable
dielectric constant (Dk) and superior performance across a wide
range of frequencies.
Key Features of Rogers RO3010:
- Dielectric Constant (Dk): 10.2 ± 0.30 at 10 GHz, which ensures
minimal signal loss and exceptional performance in high-frequency
environments.
- Dissipation Factor: With a low dissipation factor of 0.0022 at 10
GHz, Rogers RO3010 minimizes energy loss, enhancing overall
efficiency.
- Thermal Stability: The thermal decomposition temperature (Td)
exceeds 500°C, ensuring robust performance even in demanding
thermal conditions.
- Low Moisture Absorption: A moisture absorption rate of only 0.05%
enhances reliability in various environmental conditions.
- Coefficient of Thermal Expansion (CTE): With X and Y axes at 13
ppm/°C and 11 ppm/°C, and Z axis at 16 ppm/°C, Rogers RO3010 offers
excellent dimensional stability.
PCB Specifications
This 4-layer PCB is designed with precision, featuring compact
dimensions of 35mm x 42mm. Its size makes it suitable for
applications where space is limited, making it an ideal choice for
miniaturized electronic devices.
| Parameter | Specification |
| Layer Count | 4 Layers |
| Finished Board Thickness | 2.7mm |
| Minimum Trace/Space | 6/9 mils |
| Minimum Hole Size | 0.4mm |
| Blind Vias | L1-L2 |
| Finished Copper Weight | 1 oz (1.4 mils) for outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Tin |
| Silkscreen | None on both sides |
| Solder Mask | None on both sides |
| Electrical Testing | 100% electrical test conducted prior to shipment |
Stackup Configuration
The stackup of this PCB is designed to optimize performance:
- Copper Layer 1: 35 μm
- Rogers RO3010 Substrate: 50 mils (1.27mm)
- Copper Layer 2: 35 μm
- Prepreg 1060 Bonding Ply: 0.05mm
- Copper Layer 3: 35 μm
- Rogers RO3010 Substrate: 50 mils (1.27mm)
- Copper Layer 4: 35 μm
This configuration ensures effective electrical connections and
stable thermal management, which are critical for high-frequency
applications.
Quality Assurance
Every PCB undergoes a 100% electrical test prior to shipment,
ensuring compliance with IPC-Class-2 standards. This rigorous
testing process guarantees that each board performs reliably in
demanding applications.
Typical Applications
The versatility of this PCB makes it suitable for various
high-frequency applications, including:
- Automotive Radar Applications: Enhancing vehicle safety and
navigation systems.
- Global Positioning Satellite (GPS) Antennas: Ensuring precise
location tracking.
- Cellular Telecommunications Systems: Ideal for power amplifiers
and antennas, supporting reliable communication.
- Patch Antennas for Wireless Communications: Supporting seamless
connectivity for mobile devices.
- Direct Broadcast Satellites: Delivering high-quality satellite
signals for entertainment and communications.
- Datalink on Cable Systems: Facilitating efficient data
transmission for cable networks.
- Remote Meter Readers: Enhancing utility management with reliable
data collection.
- Power Backplanes: Supporting high-performance power distribution
in complex systems.
Conclusion
Choosing this advanced PCB solution guarantees that your products
will not only meet but exceed the expectations of today’s
technological landscape. Whether your focus is on
telecommunications, aerospace, or consumer electronics, this PCB is
designed to deliver the high performance you require.
For more information or to place an order, please reach out to us
today—let’s work together to enhance your electronic solutions!
