Applications
Automatic dicing system is widely used in semiconductor chip, LED
chip and EMC lead frame, PCB, IR filter, sapphire glass and ceramic
thin plate’s precision cutting .
Features of products
• Using touching LCD to operate. The interface design is simple and
easy. Provide a variety of languages such as Chinese, English,
Korean, etc.
• Can meet the high precision cutting maximum diameter of 300 mm
materials.
• High rigidity structure design is adopted to ensure high
precision and high stability of cutting process.
• CCD automatic positioning and calibration.
• Real-time monitoring of the air pressure, water pressure, current
and other values of the system to avoid spindle damage. • Cutting
spindle: 2.4 kw × 1set (Max: 60,000 rpm) • Repeat positioning
accuracy: 0.001mm
• Cutting speed: 0.05 ~ 400 mm/sec
• Standard collocation blade: 2 Inch (Max: 3 Inch)
