What circuit boards do we do? (11)
TMM4 High Frequency PCB
Introduction:
Rogers TMM 4 is a thermoset microwave material designed to offer
high plated-thru-hole reliability for strip-line and micro-strip
applications. It is a composite material that combines the
advantageous characteristics of ceramics, hydrocarbons, and
thermoset polymers.
TMM 4 materials possess robust mechanical and chemical properties,
providing many of the benefits found in both ceramic and
traditional PTFE laminates. Unlike those materials, TMM 4 laminates
do not require specialized production techniques. They are based on
thermoset resins, ensuring reliable wire-bonding without the risk
of pad lifting or substrate deformation.
Features
TMM4 laminates offer several key features as follows:
It has a dielectric constant of 4.50 +/- .045, providing stable
electrical properties for high-frequency applications, and a
dissipation factor of .0020 at 10GHz, indicating low signal loss
and efficient signal transmission.
TMM4 has a thermal coefficient of Dk of 15ppm/°K, ensuring minimal
changes in electrical performance with temperature variations.
The coefficient of thermal expansion is matched to copper, with
values of x = 16 ppm/°K, y = 16 ppm/°K, and z = 21 ppm/°K. This
compatibility reduces the risk of stress-related issues during
thermal cycling.
TMM4 laminates have a high decomposition temperature (Td) of 425 °C
TGA, ensuring their stability and reliability under elevated
temperature conditions.
It exhibits a thermal conductivity of 0.7 W/mk, facilitating
efficient heat dissipation in high-power applications.
TMM4 shows excellent resistance to moisture-related issues with
moisture absorption rates of 0.07% for a thickness of 50mil and
0.18% for a thickness of 125mil.
PCB Capability
| PCB Material: | Composite of Ceramic, hydrocarbon and thermoset polymer |
| Designator: | TMM4 |
| Dielectric constant: | 4.5 ±0.045 (process); 4.7 (design) |
| Layer count: | Single Sided, Double Sided, Multi-layer, Hybrid designs |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Laminate thickness: | 15mil (0.381mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm),
60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil
(3.175mm), 150mil (3.810mm), 200mil (5.08mm), 250mil (6.35mm),
500mil (12.7mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, Pure gold
(no nickle under gold), OSP, ENEPIG |
Our PCB manufacturing capability on TMM4 laminates is summarized in
the following table.
We offer single sided, double sided, multi-layer and hybrid PCBs,
providing flexibility to meet different design requirements.
We support copper weights of 1oz (35µm) and 2oz (70µm), allowing
you to choose the appropriate copper weight for your specific
application.
We provide a wide range of laminate thickness options to suit your
needs, such as 15mil (0.381mm), 25mil (0.635mm), 30mil (0.762mm),
50mil (1.270mm), 60mil (1.524mm), up to 500mil (12.7mm).
Our manufacturing capabilities support PCB sizes up to 400mm X
500mm, providing ample space for your designs.
We offer a variety of solder mask colors to suit your preferences
and requirements, such as green, black, blue, yellow, red, and
more.
Our surface finish options include bare copper, HASL, ENIG,
immersion tin, immersion silver, pure gold (with no nickel under
gold), OSP, and ENEPIG etc.
Typical applications
TMM4 High-Frequency PCBs are commonly used in various applications
including power amplifiers and combiners, filters and couplers,
satellite communication systems, Global Positioning Systems (GPS)
antennas, patch antennas, and chip testers etc.
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