TIF100-30-11S High-Voltage Silicone Thermal Pad Insulation Material
Heat Conduction Sheet For Efficient Heat Transfer
Product descriptions
TlF100-30-11S Series thermally conductive interface materials are
applied to fill the air gaps between the heating elements and the
heat dissipation fins or the metal base.Their flexibility and
elasticity make them suited to coat very uneven surfaces.Heat can
transmit to the metal housing or dissipation plate from the heating
elements or even the entire PCB, which effecitly enhances the
efficiency and life-time of the heat-generating electronic
components.
Features:
> Excellent thermal conductivity 3.0W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application
environments
> Available in different thickness options
Applications:
> Cooling components to the chassis of frame
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps
| Typical Properties of TIFTIM100-30-11S Series |
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction | Ceramic filled silicone elastomer | ***** |
| Specific Gravity | 3.0g/cc | ASTM D792 |
| Thickness range | 0.020"~0.200"(0.5mm~5.0mm) | ASTM D374 |
| Hardness | 45 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | ***** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 5.0MHz | ASTM D150 |
| Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 |
| Flame rating | 94 V0 | UL E331100 |
| Thermal conductivity | 3.0W/m-K | ASTM D5470 |
Product Specifications:
Standard Thickness: 0.02 to 0.20 (0.50 to 5.00 mm) with increments of 0.01" (0.25 mm).
Standard Size:8"X16"(406 mm×406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment). DC1 (Single-sided
hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes: FG (Fiberglass)provides enhanced strength, suitable for
materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.50 mm).
The TIF series is available in custom shapes and various forms. For
other thicknesses or moreinformation. please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and
manufacturing superior thermal interface materials for competitive
market. Our vast experience allows us to assist our customers best
in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make
your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality
control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
