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2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module

    Buy cheap 2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module from wholesalers
     
    Buy cheap 2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module from wholesalers
    • Buy cheap 2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module from wholesalers
    • Buy cheap 2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module from wholesalers

    2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TIF520BS
    Certification : UL & RoHS
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 1000000 pcs/month
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module

    2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module


    Company Profile


    Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


    Certifications:

    ISO9001:2015

    ISO14001: 2004 IATF16949:2016

    IECQ QC 080000:2017

    UL


    Product introduction


    TIFTM520BS use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


    Features
    > Good thermal conductive: 2.6W/mK
    > Naturally tacky needing no further adhesive coating
    > Soft and Compressible for low stress applications
    > Broad range of hardnesses available
    > Moldability for complex parts
    > Outstanding thermal performance


    Applications
    > Telecommunication hardware
    > Handheld portable electronics
    > Semiconductor automated test equipment (ATE)
    > CPU
    > Display card
    > Mainboard/mother board
    > Notebook

    Typical Properties of TIFTM520BS Series
    PropertyValueTest method
    ColorBlueVisual
    Construction &CompostionCeramic filled silicone elastomer***
    Thickness range0.020"(0.5mm)ASTM D374
    Hardness13 Shore 00ASTM 2240
    Specific Gravity3.0 g/ccASTM D792
    Continuos Use Temp-45 to 200℃***
    Dielectric Breakdown Voltage>5500 VACASTM D149
    Dielectric Constant5.0 MHzASTM D150
    Volume Resistivity2.0X1013Ohm-meterASTM D257
    Fire rating94 V0UL E331100
    Thermal conductivity2.6W/m-KASTM D5470

    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated

    Our services


    Online-service : 12 hours , Inquiry reply within fastest.


    Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

    Well-trained & experienced staff are to answer all your inquiries in English of course.

    Standard Export Carton Or Marked With Customer's Information Or Customized.

    Provide free samples


    After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

    we will help you to deal with it and give you satisfactory solution.

    Quality 2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module for sale
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