Thermal Conductive Silicone Pad Heatsink CPU 0.5-5.0mm Thermal
Interface Material Thermal Conductive Gap Filler
Company Profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was
established in 2006. Is a high-tech enterprise specializing in the
research, development, production and sales of thermal interface
materials. We mainly produce: heat-conducting joint filler, low
melting point thermal interface materials, heat-conducting
insulator, heat-conducting adhesive tape, heat-conducting interface
pad and heat-conducting grease, heat-conducting plastic, silicone
rubber, silicone rubber foam, etc. We adhere to the business
philosophy of "survival by quality, development by quality", and
continue to provide the most efficient and best service for new and
old customers with excellent quality in the spirit of rigor,
pragmatism and innovation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Product introduction
TIFTM500BS thermal silicone pad is a product with both performance and
economy. It is a unique thermal pad with low oil permeability, low
thermal resistance, high softness and high compliance.It can work
stably at -45℃~200℃ and meet the requirement of UL94V0.
Features
> Good thermal conductive: 2.6W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications
> Cooling components to the chassis of frame
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
| Typical Properties of TIFTM500BS Series |
| Property | Value | Test method |
| Color | Blue | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer | *** |
| Thickness range | 0.020"(0.5mm)~0.200"(5.0mm) | ASTM D374 |
| Hardness | 13 Shore 00 | ASTM 2240 |
| Specific Gravity | 3.0 g/cc | ASTM D792 |
| Continuos Use Temp | -45 to 200℃ | *** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 5.0 MHz | ASTM D150 |
| Volume Resistivity | 2.0X1013Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | UL E331100 |
| Thermal conductivity | 2.6W/m-K | ASTM D5470 |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Independent R&D team
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