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Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine

    Buy cheap Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine from wholesalers
     
    Buy cheap Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine from wholesalers
    • Buy cheap Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine from wholesalers
    • Buy cheap Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine from wholesalers

    Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine

    Ask Lasest Price
    Brand Name : GKG
    Model Number : GD602D
    Certification : CE
    Price : 26000
    Payment Terms : T/T
    Supply Ability : The production capacity is 30 units a month
    Delivery Time : 20-25
    • Product Details
    • Company Profile

    Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine

    Fully Automatic Smt Production Line Flip Chip Die Bonder Machine For COB Strip Light and Semiconductor Packaging Chip Mounting Electronics Machinery


    High-Speed ​​Flexible Strip Die Bonder

    Product Features
    1. Utilizes a sheet-to-sheet docking station with dual swing arms for 180° cross-bonding.

    2. Compatible with a printer to enable a variety of in-line process solutions.

    3. Fully integrated carrier from loading, printing, to die bonding and placement.

    4. The carrier supports 0.5M materials, and mid-process transfers are accomplished using a docking station.

    5. Equipped with a variety of practical features, including automatic calibration, automatic die ring changer, and a feeder-style quick-release workbench.


    Product specification

    Speed of die attach≥60ms UPH: 60K/h (actual production capacity depends on wafer and substrate size and process requirements)
    Position accuracy of die attach± 1 mil (± 25um)
    Angle accuracy of wafer± 1 °
    Crystal loss detection functionWith (vacuum detection mode)
    Solid leakage detection functionWith (vacuum detection mode)
    Capacity statistics functionYes
    Statistical function of consumables usageYes
    Function of parameter modification recordYes
    User privilege management functionYes
    Module of wafer worktable
    Size of the chip3milx5mil-60mlx60mil
    Thickness of the wafer0.1-0.7 mm
    Maximum correction angle of wafer± 15 °
    Maximum size of wafer and wafer ring6“Crystal Ring (152 mm outer diameter) .”
    Maximum area size of wafer4.7“(119 mm)
    Maximum travel of worktable152MMX152MM
    XY resolution0.5 um
    Thimble height travel in z direction3 mm
    Thimble capSingle Needle (with)
    Motor and drive systemHome-made linear motor & Huichuan District Drive
    Image recognition system
    Methods of image recognition256 grayscale
    Image resolution720 * 540
    Accuracy of image recognition± 0.025 Mil@50 Mil observed range
    Foolproof function of chipYes
    Pre-consolidation testing functionYes
    Post-consolidation image detection functionYes
    Mode of feedingAutomatic connection of incoming and outgoing materials
    Solid Crystal Swing Arm System
    The way of fixing crystalDouble Swing Arm 180 ° rotation solidification
    Suction pressure of crystal30g-250g adjustable
    Manual adjustment of suction nozzle vacuum sensitivityYes
    Module of substrate workbench
    Mounting speed5000-6000UPH
    Range of travel of worktable140mmx620mm
    Adapt to the width of the substrate60-120mm
    Adapt to the length of the substrate100-600mm
    Thickness of substrate0.1-2mm
    XY resolution0.5um
    Motor and drive systemHome-made Linear Motor & Huichuan District Drive
    Fixing method of base plateManipulator plus vacuum suction platform



    Applications:

    Product application
    COB flexible lamps are mainly used in smart home, intelligent lighting, car decoration, intelligent decoration and other applications.

    Applicable products: Flexible Lamp Belt (FPC, PCB, BT) , SMD, resistors, IC components and other flip-chip products solid crystal.


    Product Tags:

    fully automatic flip chip die bonder

      

    transistor die bonding machine

      

    semiconductor die bonder machine

      
    Quality Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine for sale

    Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine

    Company Info.
    Shenzhen Hongxinteng Technology Co., Ltd.
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