Introducing our advanced 6-layer Hybrid PCB, combining the
high-frequency capabilities of RO4350B with the mechanical strength
of high-Tg FR-4. This PCB is designed for applications requiring
exceptional performance and reliability in demanding environments,
making it ideal for various high-tech industries.
1. Base Materials:
- RO4350B: Known for its superior high-frequency performance, RO4350B boasts
a dielectric constant of 3.48 and a dissipation factor of 0.0037 at
10 GHz. This material is crucial for minimizing signal loss and
ensuring high integrity in RF applications.
- High-Tg FR-4: With a glass transition temperature (Tg) of ≥ 170°C, this material
provides excellent thermal resistance and mechanical stability,
making it suitable for high-temperature soldering processes.
Detailed Specifications
- Layer Count: 6 layers
- Board Dimensions: 155mm x 120mm (± 0.15mm)
- Minimum Trace/Space: 4/6 mils
- Minimum Hole Size: 0.4mm
- Blind Vias: None
- Finished Board Thickness: 1.6mm
- Finished Copper Weight: 1oz (1.4 mils) for outer layers
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion silver
- Silkscreen: White (Top), None (Bottom)
- Solder Mask: Green (Top and Bottom)
- Quality Assurance: 100% electrical testing prior to shipment
Artwork and Standards
- Type of Artwork Supplied: Gerber RS-274-X
- Quality Standard: IPC-Class-2
- Availability: Worldwide
| RO4350B Typical Value |
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.66 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0037
0.0031 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 5.7 x109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432)
14,153(2,053) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5)
130(18.9) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255
(37) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.5 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10
12
32 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 390 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.69 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.86 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 0.88
(5.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | (3)V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Key Advantages of Hybrid PCB
1. Performance Optimization
The combination of RO4350B and high-Tg FR-4 allows for significant
performance enhancements:
- Signal Integrity: RO4350B is ideal for high-frequency circuits,
such as antennas and RF traces, ensuring minimal signal loss and
delay. The FR-
4 material efficiently manages low-frequency and power sections,
providing cost efficiency.
- Impedance Control: The tight dielectric constant tolerance of
RO4350B (±0.05) enables precise impedance matching, which is
critical for high-frequency applications.
2. Thermal Management and Reliability
- High-Temperature Endurance: The high Tg of FR-4 accommodates
lead-free soldering processes, while RO4350B’s low coefficient of
thermal expansion (CTE) helps reduce thermal stress and the risk of
delamination.
- UL 94 V-0 Certification: RO4350B’s flame-retardant properties
enhance the overall safety and reliability of the PCB, making it
suitable for various demanding applications.
3. Cost and Manufacturing Efficiency
- Selective Material Use: By utilizing RO4350B only in
high-frequency areas, manufacturers can optimize material costs
without compromising performance.
- Process Compatibility: Both materials are compatible with
standard FR-4 processes, including drilling, etching, and
lamination, simplifying the manufacturing process and reducing the
need for specialized equipment.
Typical Applications
This hybrid PCB is suitable for a wide range of high-tech
applications, including:
- Cellular Base Station Antennas and Power Amplifiers**: Ensuring
reliable communication in mobile networks.
- RF Identification Tags: Facilitating efficient tracking and
identification.
- Automotive Radar and Sensors: Enhancing vehicle safety and
navigation systems.
- LNBs for Direct Broadcast Satellites: Delivering high-quality
signal reception for satellite communications.
Conclusion
This 6-layer Hybrid PCB with RO4350B and high-Tg FR-4 represents
the cutting edge of PCB technology, offering a combination of
performance, reliability, and cost-effectiveness. Designed for
high-frequency applications, this PCB meets the rigorous demands of
modern electronics, ensuring exceptional signal integrity and
thermal management.
Investing in our hybrid PCB solutions means choosing quality and
innovation that will enhance your electronic designs. For more
information or to discuss your specific needs, please contact our
sales team. Let us support your projects with our high quality PCB
solutions!
