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TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module

    Buy cheap TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module from wholesalers
     
    Buy cheap TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module from wholesalers
    • Buy cheap TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module from wholesalers
    • Buy cheap TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module from wholesalers

    TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TIF100-18-01US
    Certification : RoHS
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 100000pcs/day
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module

    TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module

    Product descriptions


    TlF100-18-01US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


    Features

    > Good thermal conductivity: 1.8 W/mK

    > Naturally tacky needing no further adhesive coating
    > Broad range of hardnesses available
    > Moldability for complex parts
    > Outstanding thermal performance


    Application

    > Cooling components to thechassis of frame
    > Set Top Box
    > Car Battery & Power SupplyCharging Pile
    > LED Tvi Lighting
    > Graphics Card Thermal Module

    > Handheld portable electronics
    > Semiconductor automated test equipment (ATE)
    > CPU
    > Display card
    > Mainboard/mother board

    Typical Properties of TIF100-18-01US Series
    PropertyValueTest method
    ColorBlack*****
    Construction &CompostionCeramic filled silicone elastomer*****
    Specific Gravity2.5g/ccASTM D297
    Outgassing(TML)0.45%ASTM C351
    Hardness18 Shore 00ASTM 2240
    Continuos Use Temp-45 to 200℃*****
    Dielectric Breakdown Voltage>5500 VACASTM D149
    Dielectric Constant4.5MHzASTM D150
    Volume Resistivity1.0X1012 Ohm-meterASTM D257
    Flame rating94 V0UL E331100
    Thermal conductivity1.8W/m-KASTM D5470

    Standard Thicknesses

    0.020-inch to 0.200-inch (0.5mm to 5.0mm)


    Product Sizes:

    8" x 16"(203mm x406mm)

    Individual die cut shapesand and custom thickness can be supplied.

    Please contact us for confirming

    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated


    Company Profile


    With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


    Certifications:

    ISO9001:2015

    ISO14001: 2004 IATF16949:2016

    IECQ QC 080000:2017

    UL


    Ziitek Culture


    Quality :

    Do it right the first time, total quality control

    Effectiveness:

    Work precisely and thoroughly for effectiveness

    Service:

    Quick response, On time delivery and Excellent service

    Team work:

    Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

    Quality TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module for sale
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