High-Performance Low-Melting Laptop CPU Thermal Pad PCM Phase
Change Material For Gap Filling
Dongguan Ziitek Electronic Material Technology Co., Ltd. was
established in 2006. Is a high-tech enterprise specializing in the
research, development, production and sales of thermal interface
materials. We mainly produce: heat-conducting joint filler, low
melting point thermal interface materials, heat-conducting
insulator, heat-conducting adhesive tape, heat-conducting interface
pad and heat-conducting grease, heat-conducting plastic, silicone
rubber, silicone rubber foam, etc. We adhere to the business
philosophy of "survival by quality, development by quality", and
continue to provide the most efficient and best service for new and
old customers with excellent quality in the spirit of rigor,
pragmatism and innovation.
TIC®800G Series is a high-performance, cost-effective thermal interface material
featuringa unique grain-oriented structure that enables precise
conformity to device surfaces,thereby enhancing the thermal
conduction path and transfer efficiency. When the temperature
exceeds its phase transition point of 50°℃, the material softens
and undergoes phase change,effectively filling microscopic and
uneven gaps between components to form a low thermal resistance
interface,significantly improving heat dissipation performance.
Features
> Low thermal resistance
> Self-adhesive with no need for additional surface adhesives
> Low-pressure application environment
Applications
> Power conversion equipment
> Power supply and vehicle storage battery
> Large communication switch hardware
> LED TV, Lighting
> Laptop computer
| Typical Properties of TIC®800G Series |
| Product Name | TIC®805G | TIC®806G | TIC®808G | TIC®810G | TIC®812G | Test Method |
| Color | Gray | Visual |
| Thickness | 0.005" | 0.006" | 0.008" | 0.010" | 0.012" | ASTM D374 |
| (0.127mm) | (0.152mm) | (0.203mm) | (0.254mm) | (0.305mm) |
| Density | 2.6g/cc | ASTM D792 |
| Recommended Operating Temperature (℃) | -40℃～125℃ | Ziitek Test Method |
| Phase Change Softening Temperature(℃) | 50℃~60℃ | Ziitek Test Method |
| Thermal Conductivity | 5.0 W/mK | ASTM D5470 |
| Thermal Impedance(℃-cm²/W) @50 psi | 0.014 | 0.018 | 0.02 | 0.024 | 0.028 | ASTM D5470 |
Standard Thickness:
0.005"(0.127 mm),0.006"(0.152 mm), 0.008"(0.203 mm),0.010"(0.254
mm),0.012" (0.305 mm)
For other thickness options, please contact us.
Standard size: 10”× 16"(254 mm x 406 mm),16”x 400'(406 mm x 122 m).
TIC®800G series is supplied with a white release liner and backing pad.
Die-cutting with half-cut processing can include pull
tabs.custom-shaped samples are also available.
Pressure-Sensitive Adhesive. lt is not applicable to TIC®800G series products.
Reinforcement Material: No reinforcement materialrequired.
Independent R&D team
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