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TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling

    Buy cheap TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling from wholesalers
     
    Buy cheap TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling from wholesalers
    • Buy cheap TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling from wholesalers
    • Buy cheap TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling from wholesalers

    TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TIC800G
    Certification : UL & RoHS
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 1000000 pcs/month
    Delivery Time : 3-6 work days
    • Product Details
    • Company Profile

    TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling

    TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling


    TIC®800G Series is a high-performance, cost-effective thermal interface material featuringa unique grain-oriented structure that enables precise conformity to device surfaces,thereby enhancing the thermal conduction path and transfer efficiency. When the temperature exceeds its phase transition point of 50°℃, the material softens and undergoes phase change,effectively filling microscopic and uneven gaps between components to form a low thermal resistance interface,significantly improving heat dissipation performance.


    Features
    > Low thermal resistance
    > Self-adhesive with no need for additional surface adhesives
    > Low-pressure application environment


    Applications
    > Power conversion equipment

    > Power supply and vehicle storage battery
    > Large communication switch hardware

    > LED TV, Lighting
    > Laptop computer

    Typical Properties of TIC®800G Series
    Product NameTIC®805GTIC®806GTIC®808GTIC®810GTIC®812GTest Method
    ColorGrayVisual
    Thickness0.005"0.006"0.008"0.010"0.012"ASTM D374
    (0.127mm)(0152mm)(0.203mm)(0.254mm)(0.305mm)
    Density2.6g/ccASTM D792
    Recommended Operating Temperature (℃)-40℃~125℃Ziitek Test Method
    Phase Change Softening Temperature(℃)50℃~60℃Ziitek Test Method
    Thermal Conductivity5.0 W/mKASTM D5470
    Thermal Impedance(℃-cm²/W) @50 psi0.0140.0180.020.0240.028ASTM D5470

    Standard Thickness:

    0.005"(0.127 mm),0.006"(0.152 mm), 0.008"(0.203 mm),0.010"(0.254 mm),0.012" (0.305 mm)

    For other thickness options, please contact us.


    Standard size: 10”× 16"(254 mm x 406 mm),16”x 400'(406 mm x 122 m).
    TIC®800G series is supplied with a white release liner and backing pad.

    Die-cutting with half-cut processing can include pull tabs.custom-shaped samples are also available.


    Pressure-Sensitive Adhesive. lt is not applicable to TIC®800G series products.

    Reinforcement Material: No reinforcement materialrequired.

    Company Profile

    With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

    FAQ:

    Q: Are you trading company or manufacturer ?

    A: We are manufacturer in Vietnam.


    Q:How can we get detailed price list?

    A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.


    Q: What kind of packaging you offer?

    A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

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