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Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors

    Buy cheap Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors from wholesalers
     
    Buy cheap Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors from wholesalers
    • Buy cheap Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors from wholesalers
    • Buy cheap Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors from wholesalers
    • Buy cheap Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors from wholesalers
    • Buy cheap Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors from wholesalers
    • Buy cheap Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors from wholesalers
    • Buy cheap Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors from wholesalers

    Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors

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    Brand Name : Hanast
    Model Number : HN-5508AB
    Certification : ROHS SGS
    Payment Terms : T/T
    Price : Negotiable
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    Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors

    85 Hardness Silicone For Encapsulation Connectors 5:1 Epoxy Potting Glue Black Color For Transformer Resistors 2 Components Potting Compound Material


    Product descriptions:

    HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product


    Product features:

    Low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation

    Before curing

    builder

    Epoxy resin 5508

    Curing agent 5508

    pigment

    Black / White et al

    Ruburn / transparent surface

    A sticky epoxy resin water

    r liquid specific

    c gravity, g / cm3

    1.4-1.5

    1.05

    Viscosity of 25℃

    4,500—6,000cp s

    150—250cp storage

    e Period (25℃)

    Six months

    x months


    processabili


    mixing ratio

    A: B =5:1 (weight ratio)

    Available for a time of 25℃

    2-3H (100g mix)

    curing time

    25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H

    After curing

    2 Tensile strength of kg/cm

    16-18

    2 Compressive strength of kg/cm

    18-22

    Resistance to the voltage of kv/mm

    20-22

    Surface resistance ofΩ-cm

    14

    1.2*10

    Volume resistance ofΩ-cm

    15

    1.1*10

    contraction percentage%

    0.35-0.55

    Water absorption rate was 25℃ * 24H

    <0.03%


    The hardness of SHORE A

    85-95

    distortion

    temperature ℃

    130-150

    low temperature resistant ℃

    -30

    Application:

    HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers

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