In the fast-paced world of electronics, the demand for
high-performance printed circuit boards (PCBs) is ever-increasing.
Our latest offering, a double-sided PCB made from Rogers RO4350B
material, is engineered to tackle the stringent requirements of
diverse applications, particularly in telecommunications,
automotive, and RF sectors.
Understanding RO4350B Material
Rogers RO4350B stands out as a premium woven glass reinforced
hydrocarbon/ceramic laminate, skillfully combining superior
electrical performance with manufacturability. Unlike traditional
PTFE materials, RO4350B simplifies the production process by
eliminating the need for specialized handling or through-hole
treatments, all while maintaining exceptional performance metrics.
Key Characteristics
- Dielectric Constant (Dk): Maintained at 3.48 ± 0.05 at 10 GHz,
this characteristic ensures optimal signal integrity.
- Dissipation Factor: With a low value of 0.0037 at 10 GHz, minimal
signal loss is achieved, making it ideal for high-frequency
applications.
- Thermal Stability: The material boasts a glass transition
temperature (Tg) greater than 280 °C, ensuring reliability across a
wide range of processing conditions.
Construction Features
This PCB is designed with the following specifications:
- Base Material: Rogers RO4350B, selected for its reliability and
superior performance.
- Layer Count: A double-sided configuration that accommodates
complex circuit designs.
- Dimensions: Compact dimensions of 40.8 mm x 51.6 mm, with a
tolerance of +/- 0.15 mm, make it suitable for various
applications.
- Finished Thickness: A sleek thickness of 0.29 mm enhances its
versatility.
- Copper Weight: 1 oz (1.4 mils) on the outer layers ensures
effective electrical conductivity.
- Minimum Trace/Space: Fine layouts are supported with a minimum of
4/4 mils.
- Minimum Hole Size: A versatile hole size of 0.2 mm is
incorporated for different component placements.
- Surface Finish: Immersion Gold provides excellent solderability
and protects against corrosion.
- Silkscreen: A white silkscreen on the top facilitates easy
component identification.
- Solder Mask: Green solder mask on the top enhances visibility and
protection.
- Electrical Testing: Each board undergoes rigorous 100% electrical
testing prior to shipment, guaranteeing optimal performance.
PCB Stackup
The stackup configuration comprises:
- Copper Layer 1: 35 μm
- Rogers RO4350B Core: 0.168 mm (6.6 mil)
- Copper Layer 2: 35 μm
| RO4350B Typical Value |
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.66 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0037
0.0031 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 5.7 x109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432)
14,153(2,053) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5)
130(18.9) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255
(37) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.5 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10
12
32 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 390 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.69 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.86 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 0.88
(5.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | (3)V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Benefits of RO4350B PCB
Dimensional Stability
The thermal coefficient of expansion (CTE) of RO4350B closely
matches that of copper, providing excellent dimensional stability.
This property is crucial for maintaining performance in multi-layer
board constructions under varying thermal conditions.
Cost-Effectiveness
Processing RO4350B is comparable to standard FR-4 materials, yet it
offers superior performance at a lower cost. This makes it an
attractive option for manufacturers seeking high-quality PCBs
without exceeding budget constraints.
High Performance
Designed for performance-sensitive and high-volume applications,
this PCB excels in environments requiring reliability and
efficiency. The low moisture absorption rate of 0.06% further
enhances durability, making it suitable for demanding conditions.
Typical Applications
This advanced PCB is ideal for a variety of applications,
including:
- Cellular Base Station Antennas and Power Amplifiers: Ensures
reliable signal transmission and reception.
- RF Identification Tags: Supports accurate tracking and
identification.
- Automotive Radar and Sensors: Enhances safety and navigation
systems in vehicles.
- LNBs for Direct Broadcast Satellites: Provides stable performance
in satellite communications.
Conclusion
Our double-sided PCB, utilizing Rogers RO4350B material, represents
a significant advancement in PCB technology. With its exceptional
electrical performance, outstanding thermal stability, and
cost-effectiveness, it is well-suited to meet the evolving demands
of the electronics industry. By choosing our PCB, customers can
anticipate unparalleled quality and reliability in their electronic
designs.
For more information or to place an order, please contact our
dedicated sales team. We are committed to delivering the ideal
solutions for your PCB needs.
