1.5W/M.K Blue Color TIF100-05U Thermal Pad Silicone Heating Pad For
CPU GPU
Product descriptions
TlFTM100-05U Series thermally conductive interface materials are applied to fill the
air gaps between the heating elements and the heat dissipation fins
or the metal base.Their flexibility and elasticity make them suited
to coat very uneven surfaces.Heat can transmit to the metal housing
or dissipation plate from the heating elements or even the entire
PCB, which effecitly enhances the efficiency and life-time of the
heat-generating electronic components.
Features
> Good thermal conductivity 1.5W/mK
> NMoldability for complex parts
> Soft and compressible for low stress applications
> Available in varies thicknesses
> Broad range of hardnesses available
> Moldability for complex parts
Application
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply
| Typical Properties of TIFTM100-05U Series |
| Color | Blue | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Thickness range | 0.010"~0.200"(0.25mm~5.0mm) | ASTM D374 |
| Hardness | 27±5 (Shore 00) | ASTM 2240 |
| Specific Gravity | 2.3 g/cc | ASTM D297 |
| Continuos Use Temp(℃) | -40~200℃ | ****** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 4.5 MHz | ASTM D150 |
| Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 |
| Thermal conductivity | 1.5 W/m-K | ASTM D5470 |
| Flame Rating | 94-V0 | UL E331100 |
Standard Thicknesses
0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:
8" x 16"(203mm x406mm),Individual die cut shapes and custom
thickness can be supplied.
Please contact us for confirming
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting
point thermal interface materials, thermal conductive insulators,
thermally conductive tapes, electrically & thermally conductive
Interface pads and thermal grease,Thermal Conductive
plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials
products, with well-equipped testing equipment and strong technical
force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality
control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
