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Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging

    Buy cheap Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging from wholesalers
     
    Buy cheap Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging from wholesalers
    • Buy cheap Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging from wholesalers
    • Buy cheap Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging from wholesalers
    • Buy cheap Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging from wholesalers
    • Buy cheap Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging from wholesalers

    Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging

    Ask Lasest Price
    Brand Name : Bright Pack
    Model Number : B010
    Certification : patent for invention、BRC、GRS
    Price : ¥0.02-0.11/pcs
    Payment Terms : T/T,Western Union
    Supply Ability : 200000pcs/day
    Delivery Time : 11-13work days
    • Product Details
    • Company Profile

    Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging

    Product Attributes Table for ​Anti-Static Octagonal Bottom Pouch

    AttributeDescription
    Material Structure4-layer composite: Static-dissipative polyethylene (outer layer) / Aluminum shielding / Polyester (middle layer) / Static-dissipative coating (inner layer)
    2
    4
    . Optimized for surface resistance control.
    Surface Resistance≤10¹² Ω/sq (anti-static range)
    3
    5
    , compliant with ANSI/ESD S541 and IEC 61340-5-1 standards.
    CertificationsISO 9001, ISO 14001
    2
    , and RoHS/REACH compliance
    7
    . Suitable for electronics in EPA (ESD Protected Areas)
    4
    .
    Barrier PropertiesMoisture-resistant (WVTR ≤5 g/m²·24h at 38°C/90% RH)
    2
    4
    ; moderate oxygen barrier (OTR ≤50 cm³/m²·day).
    Design FeaturesOctagonal bottom for stability; heat-sealable or zip-lock closure
    2
    8
    ; customizable print area for branding.
    ApplicationsPCB, RAM, motherboards, IC chips, and other ESD-sensitive components
    1
    4
    9
    .
    SustainabilityRecyclable polyethylene layers; optional biodegradable additives
    8
    .

    Product Specifications Table

    ParameterSpecification
    Thickness Range0.08–0.15 mm (customizable for lightweight to heavy-duty electronics)
    2
    4
    .
    DimensionsWidth: 100–400 mm; Height: 150–600 mm; Bottom gusset: 50–150 mm
    4
    8
    .
    Tear Resistance≥35 N (machine direction) / ≥30 N (transverse direction)
    3
    7
    .
    Seal Strength5–8 N/15mm (heat-sealable at 120–140°C)
    2
    8
    .
    Static DissipationSurface resistance: 10⁶–10¹² Ω/sq
    3
    5
    ; ESD shielding energy ≤30 nJ
    4
    .
    Printing Options4-color flexographic printing (±0.2 mm accuracy)
    8
    ; supports QR codes and GS1 barcodes
    2
    .
    Temperature Range-40°C to 85°C (suitable for cold chain and industrial environments)
    4
    9
    .
    MOQ & Lead TimeMOQ 50,000 units; production lead time: 15–25 days
    2
    8
    .



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