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Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad

    Buy cheap Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad from wholesalers
     
    Buy cheap Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad from wholesalers
    • Buy cheap Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad from wholesalers
    • Buy cheap Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad from wholesalers

    Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad

    Ask Lasest Price
    Brand Name : ZIITEK
    Model Number : TS-TIF100C 8045-11
    Certification : UL and RoHs
    Price : negotiation
    Supply Ability : 10000/day
    Delivery Time : 3-5work days
    • Product Details
    • Company Profile

    Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad

    Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad


    TS-TIF®100C 8045-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.


    Features:
    > Excellent thermal conductivity 8.0W/mK

    > Moldability for complex parts
    > Soft and compressible for low stress applications
    > Broad range of hardnesses available
    > BMoldability for complex parts
    > BOutstanding thermal performance


    Applications:

    > Telecommunication hardware
    > Heat Sinking Housing at LED-lit BLU in LCD
    > LED TV and LED-lit lamps
    > RDRAM memory modules
    > Micro heat pipe thermal solutions
    > Automotive engine control units

    > Telecommunication hardware
    > Handheld portable electronics
    > Semiconductor automated test equipment (ATE)
    > CPU

    > Display card
    > Mainboard/mother board
    > Notebook
    > Power supply

    Typical Properties of TS-TIF®100C 8045-11 Series
    ColorGrayVisual
    Construction & CompostionCeramic filled silicone elastomer******
    Specific Gravity3.4g/ccASTM D297
    thickness0.012"(0.30mm)~0.200"(5.00mm)ASTM D374
    Hardness (thickness<1.0mm)45 (Shore 00)ASTM 2240
    Continuos Use Temp-40 to 200℃******
    Dielectric Breakdown Voltage>5500 VACASTM D149
    Dielectric Constant7.2MHzASTM D150
    Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
    Fire rating94 V0equivalent UL
    Thermal conductivity8.0W/m-KASTM D5470

    Standard Thicknesses:


    0.020" (0.51mm) 0.030" (0.76mm)

    0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

    0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

    0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

    0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

    0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

    0.190" (4.83mm) 0.200" (5.08mm)

    Consult the factory to alternate thickness.


    Product Specification
    Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm)
    Product Sizes:8" x 16"(203mm x406mm)
    Custom die-cut shapes and thicknesses are available.Please contact us for details.
    Store in a cool, dry place, away from fire and sunlight.
    Packaging Details & Lead time

    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated


    Company Profile

    Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


    Independent R&D team


    Q: How do I place an order?

    A:1. Click the "Sent messages" button to continue with the process.

    2. Fill out the message form by entering a subject line, and message to us.

    This message should include any questions you might have about the products as well as your purchase requests.

    3. Click the "Send" button when you are finished to complete the process and send your message to us.

    4. We will reply you as soon as possible with Email or online.

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